Enhanced thermal conductivity in copolymerized polyimide
Summary: From flexible electronics and multifunctional textiles to artificial tissues, polymers penetrate nearly every aspect of modern technology. High thermal conductivity of polymers is often required in their applications, where heat dissipation is crucial to maintain product reliability and fun...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2022-11-01
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| Series: | iScience |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2589004222017230 |
| _version_ | 1811233099485282304 |
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| author | Bohai Liu Yu Zhou Lan Dong Qinghua Lu Xiangfan Xu |
| author_facet | Bohai Liu Yu Zhou Lan Dong Qinghua Lu Xiangfan Xu |
| author_sort | Bohai Liu |
| collection | DOAJ |
| description | Summary: From flexible electronics and multifunctional textiles to artificial tissues, polymers penetrate nearly every aspect of modern technology. High thermal conductivity of polymers is often required in their applications, where heat dissipation is crucial to maintain product reliability and functionality. However, the intrinsic thermal conductivity of bulk polymers is largely hindered by the randomly coiled and entangled chain conformation. Here, we report a copolymerization strategy that can simultaneously manipulate the intrachain and interchain hopping and increase the thermal conductivity of linear copolymerized polyimide (PI) to three times higher than that of pure PI at a low-level introduction of 2,4,5,7-tetraamino-1,8-dihydroxyanthracene-9,10-dione (10%). In addition, the large-scale copolymerized PI films display thermal stability after annealing. These remarkable results allow bulk PI to be a potential candidate for thermal management, and this copolymerization method may benefit future synthesis of interfacial thermal materials. |
| first_indexed | 2024-04-12T11:14:44Z |
| format | Article |
| id | doaj.art-792a6118661047468584b3605d4e14f3 |
| institution | Directory Open Access Journal |
| issn | 2589-0042 |
| language | English |
| last_indexed | 2024-04-12T11:14:44Z |
| publishDate | 2022-11-01 |
| publisher | Elsevier |
| record_format | Article |
| series | iScience |
| spelling | doaj.art-792a6118661047468584b3605d4e14f32022-12-22T03:35:31ZengElsevieriScience2589-00422022-11-012511105451Enhanced thermal conductivity in copolymerized polyimideBohai Liu0Yu Zhou1Lan Dong2Qinghua Lu3Xiangfan Xu4Center for Phononics and Thermal Energy Science, China-EU Joint Center for Nanophononics, School of Physics Science and Engineering, Tongji University, Shanghai 200092, ChinaSchool of Chemical Science and Technology, Tongji University, Shanghai 200092, ChinaSchool of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China; Shanghai Engineering Research Center of Advanced Thermal Functional Materials, Shanghai Polytechnic University, Shanghai 201209, ChinaShanghai Key Lab of Electrical & Thermal Aging, School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China; Corresponding authorCenter for Phononics and Thermal Energy Science, China-EU Joint Center for Nanophononics, School of Physics Science and Engineering, Tongji University, Shanghai 200092, China; Corresponding authorSummary: From flexible electronics and multifunctional textiles to artificial tissues, polymers penetrate nearly every aspect of modern technology. High thermal conductivity of polymers is often required in their applications, where heat dissipation is crucial to maintain product reliability and functionality. However, the intrinsic thermal conductivity of bulk polymers is largely hindered by the randomly coiled and entangled chain conformation. Here, we report a copolymerization strategy that can simultaneously manipulate the intrachain and interchain hopping and increase the thermal conductivity of linear copolymerized polyimide (PI) to three times higher than that of pure PI at a low-level introduction of 2,4,5,7-tetraamino-1,8-dihydroxyanthracene-9,10-dione (10%). In addition, the large-scale copolymerized PI films display thermal stability after annealing. These remarkable results allow bulk PI to be a potential candidate for thermal management, and this copolymerization method may benefit future synthesis of interfacial thermal materials.http://www.sciencedirect.com/science/article/pii/S2589004222017230Polymer chemistryThermal propertyPolymers |
| spellingShingle | Bohai Liu Yu Zhou Lan Dong Qinghua Lu Xiangfan Xu Enhanced thermal conductivity in copolymerized polyimide iScience Polymer chemistry Thermal property Polymers |
| title | Enhanced thermal conductivity in copolymerized polyimide |
| title_full | Enhanced thermal conductivity in copolymerized polyimide |
| title_fullStr | Enhanced thermal conductivity in copolymerized polyimide |
| title_full_unstemmed | Enhanced thermal conductivity in copolymerized polyimide |
| title_short | Enhanced thermal conductivity in copolymerized polyimide |
| title_sort | enhanced thermal conductivity in copolymerized polyimide |
| topic | Polymer chemistry Thermal property Polymers |
| url | http://www.sciencedirect.com/science/article/pii/S2589004222017230 |
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