A Novel Environment-Friendly Adhesive Based on Recycling of <i>Broussonetia papyrifera</i> Leaf Forestry Waste Protein
Wood adhesive was prepared using <i>Broussonetia papyrifera</i> waste leaf protein as the raw material. The performance of the <i>B. papyrifera</i> leaf protein adhesive compared to soy protein was investigated using X-ray diffraction, Fourier transform infrared spectroscopy,...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-02-01
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| Series: | Forests |
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| Online Access: | https://www.mdpi.com/1999-4907/13/2/291 |
| _version_ | 1797480209528651776 |
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| author | Cheng Li Yang Tang Yujie Wang Xiaoyu Yuan Bengang Zhang Zhigang Wu Huafeng Tian |
| author_facet | Cheng Li Yang Tang Yujie Wang Xiaoyu Yuan Bengang Zhang Zhigang Wu Huafeng Tian |
| author_sort | Cheng Li |
| collection | DOAJ |
| description | Wood adhesive was prepared using <i>Broussonetia papyrifera</i> waste leaf protein as the raw material. The performance of the <i>B. papyrifera</i> leaf protein adhesive compared to soy protein was investigated using X-ray diffraction, Fourier transform infrared spectroscopy, and differential scanning calorimetry. The results indicated that both <i>B. papyrifera</i> leaf protein and soy protein were spherical proteins that could easily form three-dimensional crosslinked network structures and were of potential for protein adhesive preparation. The <i>B. papyrifera</i> leaf and soy protein-based adhesives had similar curing behaviors, but the crosslinking reaction of <i>B. papyrifera</i> leaf protein-based adhesive seems to be more complex than that of the soy protein-based adhesive. The <i>B. papyrifera</i> leaf protein-based adhesive had a lower increasing trend of particle size and crystallinity than the soy-based protein adhesive, and its water resistance and bonding strength were also weaker. The plywood with BP leaf protein adhesive had dry and wet shear strengths of 0.93 MPa and 0.59 MPa, respectively. These results are promising for future industrial production using <i>Broussonetia papyrifera</i> waste leaf protein as a new protein wood adhesive in the wood industry. |
| first_indexed | 2024-03-09T21:56:49Z |
| format | Article |
| id | doaj.art-79eae771a419469eb5752804db4a7a2f |
| institution | Directory Open Access Journal |
| issn | 1999-4907 |
| language | English |
| last_indexed | 2024-03-09T21:56:49Z |
| publishDate | 2022-02-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Forests |
| spelling | doaj.art-79eae771a419469eb5752804db4a7a2f2023-11-23T19:57:13ZengMDPI AGForests1999-49072022-02-0113229110.3390/f13020291A Novel Environment-Friendly Adhesive Based on Recycling of <i>Broussonetia papyrifera</i> Leaf Forestry Waste ProteinCheng Li0Yang Tang1Yujie Wang2Xiaoyu Yuan3Bengang Zhang4Zhigang Wu5Huafeng Tian6College of Forestry, Henan Agricultural University, Zhengzhou 450002, ChinaCollege of Forestry, Henan Agricultural University, Zhengzhou 450002, ChinaCollege of Forestry, Henan Agricultural University, Zhengzhou 450002, ChinaCollege of Food Science and Technology, Henan Agricultural University, Zhengzhou 450002, ChinaIUT-LERMAB, University of Lorraine, 88000 Epinal, FranceCollege of Forestry, Guizhou University, Guiyang 550025, ChinaBeijing Key Laboratory of Quality Evaluation Technology for Hygiene and Safety of Plastics, College of Chemistry and Materials Engineering, Beijing Technology and Business University, Beijing 100048, ChinaWood adhesive was prepared using <i>Broussonetia papyrifera</i> waste leaf protein as the raw material. The performance of the <i>B. papyrifera</i> leaf protein adhesive compared to soy protein was investigated using X-ray diffraction, Fourier transform infrared spectroscopy, and differential scanning calorimetry. The results indicated that both <i>B. papyrifera</i> leaf protein and soy protein were spherical proteins that could easily form three-dimensional crosslinked network structures and were of potential for protein adhesive preparation. The <i>B. papyrifera</i> leaf and soy protein-based adhesives had similar curing behaviors, but the crosslinking reaction of <i>B. papyrifera</i> leaf protein-based adhesive seems to be more complex than that of the soy protein-based adhesive. The <i>B. papyrifera</i> leaf protein-based adhesive had a lower increasing trend of particle size and crystallinity than the soy-based protein adhesive, and its water resistance and bonding strength were also weaker. The plywood with BP leaf protein adhesive had dry and wet shear strengths of 0.93 MPa and 0.59 MPa, respectively. These results are promising for future industrial production using <i>Broussonetia papyrifera</i> waste leaf protein as a new protein wood adhesive in the wood industry.https://www.mdpi.com/1999-4907/13/2/291<i>Broussonetia papyrifera</i>leaf proteinbio-based adhesivecuring propertiesbonding performance |
| spellingShingle | Cheng Li Yang Tang Yujie Wang Xiaoyu Yuan Bengang Zhang Zhigang Wu Huafeng Tian A Novel Environment-Friendly Adhesive Based on Recycling of <i>Broussonetia papyrifera</i> Leaf Forestry Waste Protein Forests <i>Broussonetia papyrifera</i> leaf protein bio-based adhesive curing properties bonding performance |
| title | A Novel Environment-Friendly Adhesive Based on Recycling of <i>Broussonetia papyrifera</i> Leaf Forestry Waste Protein |
| title_full | A Novel Environment-Friendly Adhesive Based on Recycling of <i>Broussonetia papyrifera</i> Leaf Forestry Waste Protein |
| title_fullStr | A Novel Environment-Friendly Adhesive Based on Recycling of <i>Broussonetia papyrifera</i> Leaf Forestry Waste Protein |
| title_full_unstemmed | A Novel Environment-Friendly Adhesive Based on Recycling of <i>Broussonetia papyrifera</i> Leaf Forestry Waste Protein |
| title_short | A Novel Environment-Friendly Adhesive Based on Recycling of <i>Broussonetia papyrifera</i> Leaf Forestry Waste Protein |
| title_sort | novel environment friendly adhesive based on recycling of i broussonetia papyrifera i leaf forestry waste protein |
| topic | <i>Broussonetia papyrifera</i> leaf protein bio-based adhesive curing properties bonding performance |
| url | https://www.mdpi.com/1999-4907/13/2/291 |
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