Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure
As the miniaturization of electronic appliances and microprocessors progresses, low-permittivity interlayer materials are becoming increasingly important for their suppression of electronic crosstalk, signal propagation delay and loss, and so forth. Herein, a kind of copolyimide (CPI) film with a “f...
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| Format: | Article |
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MDPI AG
2021-10-01
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| Series: | Materials |
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| Online Access: | https://www.mdpi.com/1996-1944/14/21/6266 |
| _version_ | 1797512225362018304 |
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| author | Xiaodi Dong Mingsheng Zheng Baoquan Wan Xuejie Liu Haiping Xu Junwei Zha |
| author_facet | Xiaodi Dong Mingsheng Zheng Baoquan Wan Xuejie Liu Haiping Xu Junwei Zha |
| author_sort | Xiaodi Dong |
| collection | DOAJ |
| description | As the miniaturization of electronic appliances and microprocessors progresses, low-permittivity interlayer materials are becoming increasingly important for their suppression of electronic crosstalk, signal propagation delay and loss, and so forth. Herein, a kind of copolyimide (CPI) film with a “fluorene” rigid conjugated structure was prepared successfully. By introducing 9,9-Bis(3-fluoro-4-aminophenyl) fluorene as the rigid conjugated structure monomer, a series of CPI films with different molecular weights were fabricated by in situ polymerization, which not only achieved the reduction of permittivity but also maintained excellent thermodynamic stability. Moreover, the hydrophobicity of the CPI film was also improved with the increasing conjugated structure fraction. The lowest permittivity reached 2.53 at 10<sup>6</sup> Hz, while the thermal decomposition temperature (<i>T</i><sub>d5%</sub>) was up to 530 °C, and the tensile strength was ≥ 96 MPa. Thus, the CPI films are potential dielectric materials for microelectronic and insulation applications. |
| first_indexed | 2024-03-10T05:58:49Z |
| format | Article |
| id | doaj.art-7a9fed6021e04076a863e31a010e3d34 |
| institution | Directory Open Access Journal |
| issn | 1996-1944 |
| language | English |
| last_indexed | 2024-03-10T05:58:49Z |
| publishDate | 2021-10-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Materials |
| spelling | doaj.art-7a9fed6021e04076a863e31a010e3d342023-11-22T21:09:37ZengMDPI AGMaterials1996-19442021-10-011421626610.3390/ma14216266Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated StructureXiaodi Dong0Mingsheng Zheng1Baoquan Wan2Xuejie Liu3Haiping Xu4Junwei Zha5School of Chemistry and Biological Engineering, University of Science & Technology Beijing, Beijing 100083, ChinaSchool of Chemistry and Biological Engineering, University of Science & Technology Beijing, Beijing 100083, ChinaSchool of Chemistry and Biological Engineering, University of Science & Technology Beijing, Beijing 100083, ChinaSchool of Chemistry and Biological Engineering, University of Science & Technology Beijing, Beijing 100083, ChinaShanghai Engineering Research Center of Advanced Thermal Functional Materials, Shanghai Polytechnic University, Shanghai 201209, ChinaSchool of Chemistry and Biological Engineering, University of Science & Technology Beijing, Beijing 100083, ChinaAs the miniaturization of electronic appliances and microprocessors progresses, low-permittivity interlayer materials are becoming increasingly important for their suppression of electronic crosstalk, signal propagation delay and loss, and so forth. Herein, a kind of copolyimide (CPI) film with a “fluorene” rigid conjugated structure was prepared successfully. By introducing 9,9-Bis(3-fluoro-4-aminophenyl) fluorene as the rigid conjugated structure monomer, a series of CPI films with different molecular weights were fabricated by in situ polymerization, which not only achieved the reduction of permittivity but also maintained excellent thermodynamic stability. Moreover, the hydrophobicity of the CPI film was also improved with the increasing conjugated structure fraction. The lowest permittivity reached 2.53 at 10<sup>6</sup> Hz, while the thermal decomposition temperature (<i>T</i><sub>d5%</sub>) was up to 530 °C, and the tensile strength was ≥ 96 MPa. Thus, the CPI films are potential dielectric materials for microelectronic and insulation applications.https://www.mdpi.com/1996-1944/14/21/6266copolyimidelow permittivitythermal stabilityconjugated structure |
| spellingShingle | Xiaodi Dong Mingsheng Zheng Baoquan Wan Xuejie Liu Haiping Xu Junwei Zha Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure Materials copolyimide low permittivity thermal stability conjugated structure |
| title | Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure |
| title_full | Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure |
| title_fullStr | Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure |
| title_full_unstemmed | Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure |
| title_short | Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure |
| title_sort | low permittivity copolymerized polyimides with fluorene rigid conjugated structure |
| topic | copolyimide low permittivity thermal stability conjugated structure |
| url | https://www.mdpi.com/1996-1944/14/21/6266 |
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