Ultra-long metal nanowire arrays on solid substrate with strong bonding
<p>Abstract</p> <p>Ultra-long metal nanowire arrays with large circular area up to 25 mm in diameter were obtained by direct electrodeposition on metalized Si and glass substrates via a template-based method. Nanowires with uniform length up to 30 μm were obtained. Combini...
Main Authors: | , , , |
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Format: | Article |
Language: | English |
Published: |
SpringerOpen
2011-01-01
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Series: | Nanoscale Research Letters |
Subjects: | |
Online Access: | http://www.nanoscalereslett.com/content/6/1/525 |
Summary: | <p>Abstract</p> <p>Ultra-long metal nanowire arrays with large circular area up to 25 mm in diameter were obtained by direct electrodeposition on metalized Si and glass substrates via a template-based method. Nanowires with uniform length up to 30 μm were obtained. Combining this deposition process with lithography technology, micrometre-sized patterned metal nanowire array pads were successfully fabricated on a glass substrate. Good adhesion between the patterned nanowire array pads and the substrate was confirmed using scanning acoustic microscopy characterization. A pull-off tensile test showed strong bonding between the nanowires and the substrate. Conducting atomic force microscopy (C-AFM) measurements showed that approximately 95% of the nanowires were electrically connected with the substrate, demonstrating its viability to use as high-density interconnect.</p> |
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ISSN: | 1931-7573 1556-276X |