A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties
Benzoxazine resin has been paid more attention in the fields of aviation, electronics, automobiles and new energy industries because of its excellent comprehensive performance. Further application is limited, however, by shortcomings such as high brittleness and high curing temperature. Furthermore,...
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MDPI AG
2020-04-01
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Online Access: | https://www.mdpi.com/2073-4360/12/5/999 |
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author | Qilin Mei Honghua Wang Danliao Tong Jiuqiang Song Zhixiong Huang |
author_facet | Qilin Mei Honghua Wang Danliao Tong Jiuqiang Song Zhixiong Huang |
author_sort | Qilin Mei |
collection | DOAJ |
description | Benzoxazine resin has been paid more attention in the fields of aviation, electronics, automobiles and new energy industries because of its excellent comprehensive performance. Further application is limited, however, by shortcomings such as high brittleness and high curing temperature. Furthermore, higher thermal stability is imperiously demanded in special areas. Incorporating both an acetylene group and silicon into the benzoxazine monomer is a promising possible solution to improve the curing processability, thermal properties and toughness of benzoxazine. In this paper, an acetylene-functional/silicon-containing benzoxazine monomer was prepared by two-step synthesis, and acetylene-functional benzoxazine was also prepared as a comparison. FTIR and <sup>1</sup>H NMR confirmed the molecular structure of acetylene-functional/silicon-containing benzoxazine. Differential scanning calorimetry (DSC) analysis showed that the initial and peak degradation temperatures of acetylene-functional/silicon-containing benzoxazine were decreased by 21 °C and 18 °C compared with acetylene-functional benzoxazine, respectively. The apparent activation energy of the curing reaction of acetylene-functional/silicon-containing benzoxazine was 83.1 kJ/mol, which was slightly lower than acetylene-functional benzoxazine (84.7 kJ/mol). TGA results showed that the acetylene-functional/silicon-containing benzoxazine had a higher thermal stability than acetylene-functional benzoxazine. The temperatures of 5% weight loss of acetylene-functional/silicon-containing benzoxazine were 380 °C in nitrogen and 485 °C in air, and the char yield at 1000 °C was 80% in nitrogen and 21% in air, respectively. The results of mechanical properties showed that the impact strength of acetylene-functional/silicon-containing benzoxazine was higher than acetylene-functional benzoxazine by 35.4%. The tensile and flexural strengths of acetylene-functional/silicon-containing benzoxazine were slightly higher than that of acetylene-functional benzoxazine. |
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series | Polymers |
spelling | doaj.art-7b2b933ead5f42289394a74721c60b8c2023-11-19T22:44:12ZengMDPI AGPolymers2073-43602020-04-0112599910.3390/polym12050999A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal PropertiesQilin Mei0Honghua Wang1Danliao Tong2Jiuqiang Song3Zhixiong Huang4School of Materials Science and Engineering, Wuhan University of Technology, 122 Luoshi Road, Wuhan 430070, ChinaSchool of Materials Science and Engineering, Wuhan University of Technology, 122 Luoshi Road, Wuhan 430070, ChinaSchool of Materials Science and Engineering, Wuhan University of Technology, 122 Luoshi Road, Wuhan 430070, ChinaSchool of Materials Science and Engineering, Wuhan University of Technology, 122 Luoshi Road, Wuhan 430070, ChinaSchool of Materials Science and Engineering, Wuhan University of Technology, 122 Luoshi Road, Wuhan 430070, ChinaBenzoxazine resin has been paid more attention in the fields of aviation, electronics, automobiles and new energy industries because of its excellent comprehensive performance. Further application is limited, however, by shortcomings such as high brittleness and high curing temperature. Furthermore, higher thermal stability is imperiously demanded in special areas. Incorporating both an acetylene group and silicon into the benzoxazine monomer is a promising possible solution to improve the curing processability, thermal properties and toughness of benzoxazine. In this paper, an acetylene-functional/silicon-containing benzoxazine monomer was prepared by two-step synthesis, and acetylene-functional benzoxazine was also prepared as a comparison. FTIR and <sup>1</sup>H NMR confirmed the molecular structure of acetylene-functional/silicon-containing benzoxazine. Differential scanning calorimetry (DSC) analysis showed that the initial and peak degradation temperatures of acetylene-functional/silicon-containing benzoxazine were decreased by 21 °C and 18 °C compared with acetylene-functional benzoxazine, respectively. The apparent activation energy of the curing reaction of acetylene-functional/silicon-containing benzoxazine was 83.1 kJ/mol, which was slightly lower than acetylene-functional benzoxazine (84.7 kJ/mol). TGA results showed that the acetylene-functional/silicon-containing benzoxazine had a higher thermal stability than acetylene-functional benzoxazine. The temperatures of 5% weight loss of acetylene-functional/silicon-containing benzoxazine were 380 °C in nitrogen and 485 °C in air, and the char yield at 1000 °C was 80% in nitrogen and 21% in air, respectively. The results of mechanical properties showed that the impact strength of acetylene-functional/silicon-containing benzoxazine was higher than acetylene-functional benzoxazine by 35.4%. The tensile and flexural strengths of acetylene-functional/silicon-containing benzoxazine were slightly higher than that of acetylene-functional benzoxazine.https://www.mdpi.com/2073-4360/12/5/999benzoxazineacetylenesiliconcuring kineticsthermal stability |
spellingShingle | Qilin Mei Honghua Wang Danliao Tong Jiuqiang Song Zhixiong Huang A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties Polymers benzoxazine acetylene silicon curing kinetics thermal stability |
title | A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties |
title_full | A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties |
title_fullStr | A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties |
title_full_unstemmed | A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties |
title_short | A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties |
title_sort | novel acetylene functional silicon containing benzoxazine resin preparation curing kinetics and thermal properties |
topic | benzoxazine acetylene silicon curing kinetics thermal stability |
url | https://www.mdpi.com/2073-4360/12/5/999 |
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