A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties

A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties

Benzoxazine resin has been paid more attention in the fields of aviation, electronics, automobiles and new energy industries because of its excellent comprehensive performance. Further application is limited, however, by shortcomings such as high brittleness and high curing temperature. Furthermore,...

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Bibliographic Details
Main Authors: Qilin Mei, Honghua Wang, Danliao Tong, Jiuqiang Song, Zhixiong Huang
Format: Article
Language:English
Published: MDPI AG 2020-04-01
Series:Polymers
Subjects:
benzoxazine
acetylene
silicon
curing kinetics
thermal stability
Online Access:https://www.mdpi.com/2073-4360/12/5/999

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