Study of novel high-density solar panels based on small space interconnection technology

Small space interconnection technology (SSIT) has been utilized in solar panels recently. The application of this technology can further increase the module efficiency. However, higher power decay after long-time operation may occur due to additional risk. Therefore, in this paper, damp heat (DH), t...

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Main Authors: Huang Guoping, Zhuang Hao, Shen Honglie, Jiang Yashuai, Sun Guan, Bai Xueliang, Li Jingnan
Format: Article
Language:English
Published: EDP Sciences 2021-01-01
Series:E3S Web of Conferences
Online Access:https://www.e3s-conferences.org/articles/e3sconf/pdf/2021/36/e3sconf_aepee2021_03007.pdf
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author Huang Guoping
Zhuang Hao
Shen Honglie
Jiang Yashuai
Sun Guan
Bai Xueliang
Li Jingnan
author_facet Huang Guoping
Zhuang Hao
Shen Honglie
Jiang Yashuai
Sun Guan
Bai Xueliang
Li Jingnan
author_sort Huang Guoping
collection DOAJ
description Small space interconnection technology (SSIT) has been utilized in solar panels recently. The application of this technology can further increase the module efficiency. However, higher power decay after long-time operation may occur due to additional risk. Therefore, in this paper, damp heat (DH), thermal cycle (TC), UV irradiation and humidity freezing (HF) tests were utilized to study the weatherability performance of SSIT-based high-density solar panels fabricated with cells cut by two different techniques. The achieved data suggest that the novel high-density modules with small space between cells have good reliability in various weather conditions. The novel low-damage laser-induced cutting technique is beneficial for the improvement of module reliability.
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spelling doaj.art-7b8288308534446c93a1975340808c9b2022-12-21T16:58:20ZengEDP SciencesE3S Web of Conferences2267-12422021-01-012600300710.1051/e3sconf/202126003007e3sconf_aepee2021_03007Study of novel high-density solar panels based on small space interconnection technologyHuang Guoping0Zhuang HaoShen Honglie1Jiang Yashuai2Sun Guan3Bai Xueliang4Li JingnanCECEP Solar Energy Technology (Zhenjiang) Co. LtdCollege of Materials Science & Technology, Nanjing University of Aeronautics & AstronauticsCECEP Solar Energy Technology (Zhenjiang) Co. LtdCECEP Solar Energy Technology (Zhenjiang) Co. LtdCECEP Solar Energy Technology (Zhenjiang) Co. LtdSmall space interconnection technology (SSIT) has been utilized in solar panels recently. The application of this technology can further increase the module efficiency. However, higher power decay after long-time operation may occur due to additional risk. Therefore, in this paper, damp heat (DH), thermal cycle (TC), UV irradiation and humidity freezing (HF) tests were utilized to study the weatherability performance of SSIT-based high-density solar panels fabricated with cells cut by two different techniques. The achieved data suggest that the novel high-density modules with small space between cells have good reliability in various weather conditions. The novel low-damage laser-induced cutting technique is beneficial for the improvement of module reliability.https://www.e3s-conferences.org/articles/e3sconf/pdf/2021/36/e3sconf_aepee2021_03007.pdf
spellingShingle Huang Guoping
Zhuang Hao
Shen Honglie
Jiang Yashuai
Sun Guan
Bai Xueliang
Li Jingnan
Study of novel high-density solar panels based on small space interconnection technology
E3S Web of Conferences
title Study of novel high-density solar panels based on small space interconnection technology
title_full Study of novel high-density solar panels based on small space interconnection technology
title_fullStr Study of novel high-density solar panels based on small space interconnection technology
title_full_unstemmed Study of novel high-density solar panels based on small space interconnection technology
title_short Study of novel high-density solar panels based on small space interconnection technology
title_sort study of novel high density solar panels based on small space interconnection technology
url https://www.e3s-conferences.org/articles/e3sconf/pdf/2021/36/e3sconf_aepee2021_03007.pdf
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