Linear Characterization and Modeling of GaN-on-Si HEMT Technologies with 100 nm and 60 nm Gate Lengths

Motivated by the growing interest towards low-cost, restriction-free MMIC processes suitable for multi-function, possibly space-qualified applications, this contribution reports the extraction of reliable linear models for two advanced GaN-on-Si HEMT technologies, namely OMMIC’s D01GH (100 nm gate l...

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Main Authors: Sergio Colangeli, Walter Ciccognani, Patrick Ettore Longhi, Lorenzo Pace, Julien Poulain, Rémy Leblanc, Ernesto Limiti
Format: Article
Language:English
Published: MDPI AG 2021-01-01
Series:Electronics
Subjects:
Online Access:https://www.mdpi.com/2079-9292/10/2/134
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author Sergio Colangeli
Walter Ciccognani
Patrick Ettore Longhi
Lorenzo Pace
Julien Poulain
Rémy Leblanc
Ernesto Limiti
author_facet Sergio Colangeli
Walter Ciccognani
Patrick Ettore Longhi
Lorenzo Pace
Julien Poulain
Rémy Leblanc
Ernesto Limiti
author_sort Sergio Colangeli
collection DOAJ
description Motivated by the growing interest towards low-cost, restriction-free MMIC processes suitable for multi-function, possibly space-qualified applications, this contribution reports the extraction of reliable linear models for two advanced GaN-on-Si HEMT technologies, namely OMMIC’s D01GH (100 nm gate length) and D006GH (60 nm gate length). This objective is pursued by means of both classical and more novel approaches. In particular, the latter include a nondestructive method for determining the extrinsic resistances and an optimizaion-based approach to extracting the remaining parasitic elements: these support standard DC and RF measurements in order to obtain a scalable, bias-dependent equivalent-circuit model capturing the small-signal behavior of the two processes. As to the noise model, this is extracted by applying the well known noise-temperature approach to noise figure measurements performed in two different frequency ranges: a lower band, where a standard Y-factor test bench is used, and an upper band, where a custom cold-source test bench is set up and described in great detail. At 5 V drain-source voltage, minimum noise figures as low as 1.5 dB and 1.1 dB at 40 GHz have been extracted for the considered 100 nm and 60 nm HEMTs, respectively: this testifies the maturity of both processes and the effectiveness of the gate length reduction. The characterization and modeling campaign, here presented for the first time, has been repeatedly validated by published designs, a couple of which are reviewed for the Reader’s convenience.
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spelling doaj.art-7bf7176d099647bcbd15409312f4d97f2023-12-03T12:38:14ZengMDPI AGElectronics2079-92922021-01-0110213410.3390/electronics10020134Linear Characterization and Modeling of GaN-on-Si HEMT Technologies with 100 nm and 60 nm Gate LengthsSergio Colangeli0Walter Ciccognani1Patrick Ettore Longhi2Lorenzo Pace3Julien Poulain4Rémy Leblanc5Ernesto Limiti6Electronics Engineering, University of Roma Tor Vergata, Via del Politecnico 1, 00133 Roma, ItalyElectronics Engineering, University of Roma Tor Vergata, Via del Politecnico 1, 00133 Roma, ItalyElectronics Engineering, University of Roma Tor Vergata, Via del Politecnico 1, 00133 Roma, ItalyElectronics Engineering, University of Roma Tor Vergata, Via del Politecnico 1, 00133 Roma, ItalyOMMIC SAS, 2 rue du Moulin, 94453 Limeil Brévannes, FranceOMMIC SAS, 2 rue du Moulin, 94453 Limeil Brévannes, FranceElectronics Engineering, University of Roma Tor Vergata, Via del Politecnico 1, 00133 Roma, ItalyMotivated by the growing interest towards low-cost, restriction-free MMIC processes suitable for multi-function, possibly space-qualified applications, this contribution reports the extraction of reliable linear models for two advanced GaN-on-Si HEMT technologies, namely OMMIC’s D01GH (100 nm gate length) and D006GH (60 nm gate length). This objective is pursued by means of both classical and more novel approaches. In particular, the latter include a nondestructive method for determining the extrinsic resistances and an optimizaion-based approach to extracting the remaining parasitic elements: these support standard DC and RF measurements in order to obtain a scalable, bias-dependent equivalent-circuit model capturing the small-signal behavior of the two processes. As to the noise model, this is extracted by applying the well known noise-temperature approach to noise figure measurements performed in two different frequency ranges: a lower band, where a standard Y-factor test bench is used, and an upper band, where a custom cold-source test bench is set up and described in great detail. At 5 V drain-source voltage, minimum noise figures as low as 1.5 dB and 1.1 dB at 40 GHz have been extracted for the considered 100 nm and 60 nm HEMTs, respectively: this testifies the maturity of both processes and the effectiveness of the gate length reduction. The characterization and modeling campaign, here presented for the first time, has been repeatedly validated by published designs, a couple of which are reviewed for the Reader’s convenience.https://www.mdpi.com/2079-9292/10/2/134gallium nitride on siliconHEMTcharacterizationmodelingscalable SSECnoise temperatures
spellingShingle Sergio Colangeli
Walter Ciccognani
Patrick Ettore Longhi
Lorenzo Pace
Julien Poulain
Rémy Leblanc
Ernesto Limiti
Linear Characterization and Modeling of GaN-on-Si HEMT Technologies with 100 nm and 60 nm Gate Lengths
Electronics
gallium nitride on silicon
HEMT
characterization
modeling
scalable SSEC
noise temperatures
title Linear Characterization and Modeling of GaN-on-Si HEMT Technologies with 100 nm and 60 nm Gate Lengths
title_full Linear Characterization and Modeling of GaN-on-Si HEMT Technologies with 100 nm and 60 nm Gate Lengths
title_fullStr Linear Characterization and Modeling of GaN-on-Si HEMT Technologies with 100 nm and 60 nm Gate Lengths
title_full_unstemmed Linear Characterization and Modeling of GaN-on-Si HEMT Technologies with 100 nm and 60 nm Gate Lengths
title_short Linear Characterization and Modeling of GaN-on-Si HEMT Technologies with 100 nm and 60 nm Gate Lengths
title_sort linear characterization and modeling of gan on si hemt technologies with 100 nm and 60 nm gate lengths
topic gallium nitride on silicon
HEMT
characterization
modeling
scalable SSEC
noise temperatures
url https://www.mdpi.com/2079-9292/10/2/134
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