Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints
The low melting temperature In-48Sn alloy is a promising candidate for flexible devices. However, the joint strength of the In-48Sn alloy on the Cu substrate was low due to the rapid diffusion of Cu into the In-rich alloy. In this study, the effect of the addition of xCu (x = 2.0 and 8.0 wt.%) on we...
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MDPI AG
2021-12-01
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| Online Access: | https://www.mdpi.com/2075-4701/12/1/33 |
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| author | Duy Le Han Yu-An Shen Fupeng Huo Hiroshi Nishikawa |
| author_facet | Duy Le Han Yu-An Shen Fupeng Huo Hiroshi Nishikawa |
| author_sort | Duy Le Han |
| collection | DOAJ |
| description | The low melting temperature In-48Sn alloy is a promising candidate for flexible devices. However, the joint strength of the In-48Sn alloy on the Cu substrate was low due to the rapid diffusion of Cu into the In-rich alloy. In this study, the effect of the addition of xCu (x = 2.0 and 8.0 wt.%) on wettability, interfacial reaction, and mechanical strength of the In-Sn-xCu/Cu joint is analyzed. The results demonstrate that both the In-48Sn and In-Sn-xCu alloys exhibit good wettability on the Cu substrate and that the contact angle increases with an increase in the Cu content. Furthermore, fine grains are observed in the alloy matrix of the In-Sn-xCu/Cu joint and the interfacial intermetallic compound (IMC) comprising the Cu-rich Cu<sub>6</sub>(In,Sn)<sub>5</sub> near the Cu substrate and the Cu-deficient Cu(In,Sn)<sub>2</sub> near the solder side. The In-Sn-2.0Cu/Cu joint with fine microstructure and a small amount of IMC in the alloy matrix shows the highest average shear strength of 16.5 MPa. Although the In-Sn-8.0Cu/Cu joint also exhibits fine grains, the presence of large number of voids and rough interfacial IMC layer causes the formation of additional stress concentration points, thereby reducing the average shear strength of the joint. |
| first_indexed | 2024-03-10T00:56:46Z |
| format | Article |
| id | doaj.art-7c42daad971440abb8b2e1d178e4ba12 |
| institution | Directory Open Access Journal |
| issn | 2075-4701 |
| language | English |
| last_indexed | 2024-03-10T00:56:46Z |
| publishDate | 2021-12-01 |
| publisher | MDPI AG |
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| spelling | doaj.art-7c42daad971440abb8b2e1d178e4ba122023-11-23T14:41:17ZengMDPI AGMetals2075-47012021-12-011213310.3390/met12010033Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu JointsDuy Le Han0Yu-An Shen1Fupeng Huo2Hiroshi Nishikawa3Joining and Welding Research Institute, Osaka University, Osaka 567-0047, JapanDepartment of Materials Science and Engineering, Feng Chia University, Taichung 407, TaiwanJoining and Welding Research Institute, Osaka University, Osaka 567-0047, JapanJoining and Welding Research Institute, Osaka University, Osaka 567-0047, JapanThe low melting temperature In-48Sn alloy is a promising candidate for flexible devices. However, the joint strength of the In-48Sn alloy on the Cu substrate was low due to the rapid diffusion of Cu into the In-rich alloy. In this study, the effect of the addition of xCu (x = 2.0 and 8.0 wt.%) on wettability, interfacial reaction, and mechanical strength of the In-Sn-xCu/Cu joint is analyzed. The results demonstrate that both the In-48Sn and In-Sn-xCu alloys exhibit good wettability on the Cu substrate and that the contact angle increases with an increase in the Cu content. Furthermore, fine grains are observed in the alloy matrix of the In-Sn-xCu/Cu joint and the interfacial intermetallic compound (IMC) comprising the Cu-rich Cu<sub>6</sub>(In,Sn)<sub>5</sub> near the Cu substrate and the Cu-deficient Cu(In,Sn)<sub>2</sub> near the solder side. The In-Sn-2.0Cu/Cu joint with fine microstructure and a small amount of IMC in the alloy matrix shows the highest average shear strength of 16.5 MPa. Although the In-Sn-8.0Cu/Cu joint also exhibits fine grains, the presence of large number of voids and rough interfacial IMC layer causes the formation of additional stress concentration points, thereby reducing the average shear strength of the joint.https://www.mdpi.com/2075-4701/12/1/33low-temperature alloyIn-48Sn alloyinterfacial reactionsolder joint strengthshear fracture surfacewettability |
| spellingShingle | Duy Le Han Yu-An Shen Fupeng Huo Hiroshi Nishikawa Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints Metals low-temperature alloy In-48Sn alloy interfacial reaction solder joint strength shear fracture surface wettability |
| title | Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints |
| title_full | Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints |
| title_fullStr | Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints |
| title_full_unstemmed | Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints |
| title_short | Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints |
| title_sort | microstructure evolution and shear strength of tin indium xcu cu joints |
| topic | low-temperature alloy In-48Sn alloy interfacial reaction solder joint strength shear fracture surface wettability |
| url | https://www.mdpi.com/2075-4701/12/1/33 |
| work_keys_str_mv | AT duylehan microstructureevolutionandshearstrengthoftinindiumxcucujoints AT yuanshen microstructureevolutionandshearstrengthoftinindiumxcucujoints AT fupenghuo microstructureevolutionandshearstrengthoftinindiumxcucujoints AT hiroshinishikawa microstructureevolutionandshearstrengthoftinindiumxcucujoints |