CFD analysis of hybrid nanofluid-based microchannel heat sink for electronic chips cooling: Applications in nano-energy thermal devices
The utilize of microchannel in miniature thermal devices and microchannel heat sinks has advanced the scientific method of heat transfer to a new level, and the fields of electronic device cooling, aerospace industries, bioengineering, and materials science are all interested in furthering the techn...
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| Format: | Article |
| Language: | English |
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Elsevier
2023-04-01
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| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X23001247 |
| _version_ | 1797866914709504000 |
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| author | Yu-Ming Chu Umar Farooq Nidhish Kumar Mishra Zubair Ahmad Fakhar Zulfiqar Sumeira Yasmin Shan Ali Khan |
| author_facet | Yu-Ming Chu Umar Farooq Nidhish Kumar Mishra Zubair Ahmad Fakhar Zulfiqar Sumeira Yasmin Shan Ali Khan |
| author_sort | Yu-Ming Chu |
| collection | DOAJ |
| description | The utilize of microchannel in miniature thermal devices and microchannel heat sinks has advanced the scientific method of heat transfer to a new level, and the fields of electronic device cooling, aerospace industries, bioengineering, and materials science are all interested in furthering the technology's advancement. The microchannel has been numerically, practically, and analytically evaluated for the past three decades in order to develop models of hydraulic and heat efficiency during flowing fluid. Microchannel heat sink and novel fluids such as nanofluids are becoming well-liked. In order to recent time the full potential hybrid nanofluid in thermal exchanger has not yet been demoralized. In order to fulfill the lack of sufficient modeling data in this advanced research, the purpose of this analysis is to scrutinize computational thermal transportation features of alumina nitride (AIN)-alumina oxide (Al2O3) –Water hybrid nanofluid through electronic chip in six circular microchannel heat sinks. The simulation procedure is performed with volume fraction in range of 1% to 4%. The effects of coefficient of heat transfer, Nusselt number, Darcy friction factor, pressure drop and thermal resistance has been investigated. The single phase, laminar, incompressible and steady-state fluid flow has been numerically solved by the finite volume method with Computational Fluid Dynamic commercial software ANSYS FLUENT (R19.2) and SIMPLE algorithm. |
| first_indexed | 2024-04-09T23:33:02Z |
| format | Article |
| id | doaj.art-7c4c5563ea9446ac8991f95a2219a66d |
| institution | Directory Open Access Journal |
| issn | 2214-157X |
| language | English |
| last_indexed | 2024-04-09T23:33:02Z |
| publishDate | 2023-04-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Case Studies in Thermal Engineering |
| spelling | doaj.art-7c4c5563ea9446ac8991f95a2219a66d2023-03-21T04:16:24ZengElsevierCase Studies in Thermal Engineering2214-157X2023-04-0144102818CFD analysis of hybrid nanofluid-based microchannel heat sink for electronic chips cooling: Applications in nano-energy thermal devicesYu-Ming Chu0Umar Farooq1Nidhish Kumar Mishra2Zubair Ahmad3Fakhar Zulfiqar4Sumeira Yasmin5Shan Ali Khan6School of Science, Hunan City University, Yiyang, 413000, PR China; Department of Mathematics, Huzhou University, Huzhou, 313000, PR ChinaSchool of Mechanical & Manufacturing Engineering, National University of Science and Technology (NUST), Islamabad, 44000, PakistanDepartment of Basic Science, College of Sciences and Theoretical Studies, Saudi Electronic University, Riyadh, 11673, Saudi ArabiaUnit of Bee Research and Honey Production, Faculty of Science, King Khalid University, P.O. Box 9004, Abha, 61413, Saudi Arabia; Applied College, Mahala Campus, King Khalid University, P.O. Box 9004, Abha, 61413, Saudi ArabiaSchool of Energy and Power Engineering, Xian Jiaotong University, Xian, 710049, PR ChinaDepartment of Mathematics, Government College University, Faisalabad, 38000, PakistanDepartment of Mathematics, Government College University, Faisalabad, 38000, Pakistan; Corresponding author.The utilize of microchannel in miniature thermal devices and microchannel heat sinks has advanced the scientific method of heat transfer to a new level, and the fields of electronic device cooling, aerospace industries, bioengineering, and materials science are all interested in furthering the technology's advancement. The microchannel has been numerically, practically, and analytically evaluated for the past three decades in order to develop models of hydraulic and heat efficiency during flowing fluid. Microchannel heat sink and novel fluids such as nanofluids are becoming well-liked. In order to recent time the full potential hybrid nanofluid in thermal exchanger has not yet been demoralized. In order to fulfill the lack of sufficient modeling data in this advanced research, the purpose of this analysis is to scrutinize computational thermal transportation features of alumina nitride (AIN)-alumina oxide (Al2O3) –Water hybrid nanofluid through electronic chip in six circular microchannel heat sinks. The simulation procedure is performed with volume fraction in range of 1% to 4%. The effects of coefficient of heat transfer, Nusselt number, Darcy friction factor, pressure drop and thermal resistance has been investigated. The single phase, laminar, incompressible and steady-state fluid flow has been numerically solved by the finite volume method with Computational Fluid Dynamic commercial software ANSYS FLUENT (R19.2) and SIMPLE algorithm.http://www.sciencedirect.com/science/article/pii/S2214157X23001247AIN−Al2O3/WaterHybrid nanofluidElectronic chipMiniature thermal devicesMicrochannel heat sinkCFDANSYS |
| spellingShingle | Yu-Ming Chu Umar Farooq Nidhish Kumar Mishra Zubair Ahmad Fakhar Zulfiqar Sumeira Yasmin Shan Ali Khan CFD analysis of hybrid nanofluid-based microchannel heat sink for electronic chips cooling: Applications in nano-energy thermal devices Case Studies in Thermal Engineering AIN−Al2O3/WaterHybrid nanofluid Electronic chip Miniature thermal devices Microchannel heat sink CFD ANSYS |
| title | CFD analysis of hybrid nanofluid-based microchannel heat sink for electronic chips cooling: Applications in nano-energy thermal devices |
| title_full | CFD analysis of hybrid nanofluid-based microchannel heat sink for electronic chips cooling: Applications in nano-energy thermal devices |
| title_fullStr | CFD analysis of hybrid nanofluid-based microchannel heat sink for electronic chips cooling: Applications in nano-energy thermal devices |
| title_full_unstemmed | CFD analysis of hybrid nanofluid-based microchannel heat sink for electronic chips cooling: Applications in nano-energy thermal devices |
| title_short | CFD analysis of hybrid nanofluid-based microchannel heat sink for electronic chips cooling: Applications in nano-energy thermal devices |
| title_sort | cfd analysis of hybrid nanofluid based microchannel heat sink for electronic chips cooling applications in nano energy thermal devices |
| topic | AIN−Al2O3/WaterHybrid nanofluid Electronic chip Miniature thermal devices Microchannel heat sink CFD ANSYS |
| url | http://www.sciencedirect.com/science/article/pii/S2214157X23001247 |
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