CFD analysis of hybrid nanofluid-based microchannel heat sink for electronic chips cooling: Applications in nano-energy thermal devices
The utilize of microchannel in miniature thermal devices and microchannel heat sinks has advanced the scientific method of heat transfer to a new level, and the fields of electronic device cooling, aerospace industries, bioengineering, and materials science are all interested in furthering the techn...
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-04-01
|
| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X23001247 |