Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling
With the increase of power level and integration in electric vehicle controllers, the heat flux of the key silicon-based IGBT (Insulated Gate Bipolar Transistor) device has reached its physical limit. At present, third-generation semiconductor devices including SiC MOSFETs (Metal-Oxide-Semiconductor...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-03-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/13/4/554 |
| _version_ | 1797444859385085952 |
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| author | Lipeng Tan Peisheng Liu Chenhui She Pengpeng Xu Lei Yan Hui Quan |
| author_facet | Lipeng Tan Peisheng Liu Chenhui She Pengpeng Xu Lei Yan Hui Quan |
| author_sort | Lipeng Tan |
| collection | DOAJ |
| description | With the increase of power level and integration in electric vehicle controllers, the heat flux of the key silicon-based IGBT (Insulated Gate Bipolar Transistor) device has reached its physical limit. At present, third-generation semiconductor devices including SiC MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistor) are gradually replacing the dominant IGBT module. The hybrid IGBT module consists of both and can improve the performance and reduce the cost of controllers. Limits due to the installation space, location, and other conditions in the car make it difficult to meet the requirements of controllers with an air-cooled heatsink due to their large size and limited heat dissipation capacity. A smaller and more powerful water-cooled heatsink case is required to ensure the heat dissipation of the IGBT in the controller. Based on previous experience in finite element numerical simulation, hydrodynamics calculation, and heat transfer calculation, ANSYS Workbench finite element software was used to analyze the thermal resistance of each structure inside the module and the heatsink structure. The fluid characteristics and heat transfer performance of three different flow channel structures were analyzed, and the design of the cooling flow fin was improved to provide a reference for the heat dissipation of the hybrid IGBT module. |
| first_indexed | 2024-03-09T13:17:33Z |
| format | Article |
| id | doaj.art-7d65d7d4f6814b18a9fd1a73fc7aa9de |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-09T13:17:33Z |
| publishDate | 2022-03-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-7d65d7d4f6814b18a9fd1a73fc7aa9de2023-11-30T21:33:54ZengMDPI AGMicromachines2072-666X2022-03-0113455410.3390/mi13040554Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid CouplingLipeng Tan0Peisheng Liu1Chenhui She2Pengpeng Xu3Lei Yan4Hui Quan5Jiangsu Key Laboratory of ASIC Design, College of Information Science and Technology, Nantong University, Nantong 226019, ChinaJiangsu Key Laboratory of ASIC Design, College of Information Science and Technology, Nantong University, Nantong 226019, ChinaJiangsu Key Laboratory of ASIC Design, College of Information Science and Technology, Nantong University, Nantong 226019, ChinaJiangsu Key Laboratory of ASIC Design, College of Information Science and Technology, Nantong University, Nantong 226019, ChinaJiangsu Key Laboratory of ASIC Design, College of Information Science and Technology, Nantong University, Nantong 226019, ChinaCollege of Science, Nantong University, Nantong 226019, ChinaWith the increase of power level and integration in electric vehicle controllers, the heat flux of the key silicon-based IGBT (Insulated Gate Bipolar Transistor) device has reached its physical limit. At present, third-generation semiconductor devices including SiC MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistor) are gradually replacing the dominant IGBT module. The hybrid IGBT module consists of both and can improve the performance and reduce the cost of controllers. Limits due to the installation space, location, and other conditions in the car make it difficult to meet the requirements of controllers with an air-cooled heatsink due to their large size and limited heat dissipation capacity. A smaller and more powerful water-cooled heatsink case is required to ensure the heat dissipation of the IGBT in the controller. Based on previous experience in finite element numerical simulation, hydrodynamics calculation, and heat transfer calculation, ANSYS Workbench finite element software was used to analyze the thermal resistance of each structure inside the module and the heatsink structure. The fluid characteristics and heat transfer performance of three different flow channel structures were analyzed, and the design of the cooling flow fin was improved to provide a reference for the heat dissipation of the hybrid IGBT module.https://www.mdpi.com/2072-666X/13/4/554IGBT modulewater-cooled heatsinkANSYSjunction temperaturetemperature fieldfluent field |
| spellingShingle | Lipeng Tan Peisheng Liu Chenhui She Pengpeng Xu Lei Yan Hui Quan Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling Micromachines IGBT module water-cooled heatsink ANSYS junction temperature temperature field fluent field |
| title | Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling |
| title_full | Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling |
| title_fullStr | Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling |
| title_full_unstemmed | Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling |
| title_short | Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling |
| title_sort | heat dissipation characteristics of igbt module based on flow solid coupling |
| topic | IGBT module water-cooled heatsink ANSYS junction temperature temperature field fluent field |
| url | https://www.mdpi.com/2072-666X/13/4/554 |
| work_keys_str_mv | AT lipengtan heatdissipationcharacteristicsofigbtmodulebasedonflowsolidcoupling AT peishengliu heatdissipationcharacteristicsofigbtmodulebasedonflowsolidcoupling AT chenhuishe heatdissipationcharacteristicsofigbtmodulebasedonflowsolidcoupling AT pengpengxu heatdissipationcharacteristicsofigbtmodulebasedonflowsolidcoupling AT leiyan heatdissipationcharacteristicsofigbtmodulebasedonflowsolidcoupling AT huiquan heatdissipationcharacteristicsofigbtmodulebasedonflowsolidcoupling |