Energy transfer and power consumption analysis of coaxial ring TSV
The purpose of this paper is to design and simulate a coaxial ring TSV, and to analyze the behavior of energy transmission and power consumption of the structure during the feeding process. By controlling the structure parameters suitable for low-power, high-performance feeding transmission, the pow...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2022-11-01
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| Series: | Energy Reports |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2352484722014652 |
| _version_ | 1828010114765815808 |
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| author | Junhao Wang Bihao Sun Zhiyuan Zhu |
| author_facet | Junhao Wang Bihao Sun Zhiyuan Zhu |
| author_sort | Junhao Wang |
| collection | DOAJ |
| description | The purpose of this paper is to design and simulate a coaxial ring TSV, and to analyze the behavior of energy transmission and power consumption of the structure during the feeding process. By controlling the structure parameters suitable for low-power, high-performance feeding transmission, the power is maximized from the feeder to the receiver, thus achieving low power consumption. The designed coaxial ring TSV will use the finite element analysis method to simulate and verify the change of insertion loss of silicon through hole at different frequencies. At the same time, the mathematical equivalent models of internal resistance, capacitance, conductivity and power of coaxial ring TSV are extracted. The simulation results show that compared with the cylindrical TSV structure, the insertion loss of this structure is smaller, indicating that the energy loss is smaller. It has research significance for energy saving of packaging system and complete transmission of electrical signal in integrated circuit. |
| first_indexed | 2024-04-10T08:49:08Z |
| format | Article |
| id | doaj.art-7dc034da860343bc858f0403042983d2 |
| institution | Directory Open Access Journal |
| issn | 2352-4847 |
| language | English |
| last_indexed | 2024-04-10T08:49:08Z |
| publishDate | 2022-11-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Energy Reports |
| spelling | doaj.art-7dc034da860343bc858f0403042983d22023-02-22T04:31:02ZengElsevierEnergy Reports2352-48472022-11-018192198Energy transfer and power consumption analysis of coaxial ring TSVJunhao Wang0Bihao Sun1Zhiyuan Zhu2College of Electronic and Information Engineering, Southwest University, Chongqing, ChinaCollege of Electronic and Information Engineering, Southwest University, Chongqing, China; Key Laboratory of Microelectronic Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, ChinaCollege of Electronic and Information Engineering, Southwest University, Chongqing, China; Corresponding author.The purpose of this paper is to design and simulate a coaxial ring TSV, and to analyze the behavior of energy transmission and power consumption of the structure during the feeding process. By controlling the structure parameters suitable for low-power, high-performance feeding transmission, the power is maximized from the feeder to the receiver, thus achieving low power consumption. The designed coaxial ring TSV will use the finite element analysis method to simulate and verify the change of insertion loss of silicon through hole at different frequencies. At the same time, the mathematical equivalent models of internal resistance, capacitance, conductivity and power of coaxial ring TSV are extracted. The simulation results show that compared with the cylindrical TSV structure, the insertion loss of this structure is smaller, indicating that the energy loss is smaller. It has research significance for energy saving of packaging system and complete transmission of electrical signal in integrated circuit.http://www.sciencedirect.com/science/article/pii/S2352484722014652Power analysisCoaxial ringThrough Silicon Via (TSV) |
| spellingShingle | Junhao Wang Bihao Sun Zhiyuan Zhu Energy transfer and power consumption analysis of coaxial ring TSV Energy Reports Power analysis Coaxial ring Through Silicon Via (TSV) |
| title | Energy transfer and power consumption analysis of coaxial ring TSV |
| title_full | Energy transfer and power consumption analysis of coaxial ring TSV |
| title_fullStr | Energy transfer and power consumption analysis of coaxial ring TSV |
| title_full_unstemmed | Energy transfer and power consumption analysis of coaxial ring TSV |
| title_short | Energy transfer and power consumption analysis of coaxial ring TSV |
| title_sort | energy transfer and power consumption analysis of coaxial ring tsv |
| topic | Power analysis Coaxial ring Through Silicon Via (TSV) |
| url | http://www.sciencedirect.com/science/article/pii/S2352484722014652 |
| work_keys_str_mv | AT junhaowang energytransferandpowerconsumptionanalysisofcoaxialringtsv AT bihaosun energytransferandpowerconsumptionanalysisofcoaxialringtsv AT zhiyuanzhu energytransferandpowerconsumptionanalysisofcoaxialringtsv |