An overview of friction stir processing of Cu–SiC composites: Microstructural, mechanical, tribological, and electrical properties
Copper matrix composite reinforced with SiC exhibits high electrical and thermal conductivity, as well as superior mechanical properties, making it a potential candidate for thermal management applications. There has been rapid progress in the understanding of Cu–SiC metal matrix composites during t...
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| Format: | Article |
| Language: | English |
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Elsevier
2023-11-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423023268 |
| _version_ | 1797301596084764672 |
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| author | Mohammad Reza Akbarpour Homayoun Mousa Mirabad Farid Gazani Iman Khezri Amirhossein Ahmadi Chadegani Ali Moeini Hyoung Seop Kim |
| author_facet | Mohammad Reza Akbarpour Homayoun Mousa Mirabad Farid Gazani Iman Khezri Amirhossein Ahmadi Chadegani Ali Moeini Hyoung Seop Kim |
| author_sort | Mohammad Reza Akbarpour |
| collection | DOAJ |
| description | Copper matrix composite reinforced with SiC exhibits high electrical and thermal conductivity, as well as superior mechanical properties, making it a potential candidate for thermal management applications. There has been rapid progress in the understanding of Cu–SiC metal matrix composites during the past decade. To accomplish this, powder metallurgy, casting, selective laser melting, composite electroforming technology, and electrodeposition methods have been employed. The optimum cutting conditions for fabrication of Cu–SiC metal matrix composites are still being explored. In recent years, friction stir processing (FSP) has become increasingly popular in the fabrication of composites. FSP is capable of microstructural engineering in Cu–SiC systems. In light of the fact that the electrical/thermal conductivity and mechanical performance of Cu–SiC composites depend on microstructural characteristics such as SiC distribution, grain size, grain orientation, density of dislocations, and bulk density, it seems important to study the effect of manufacturing conditions on microstructure in detail. In this study, the influence of FSP parameters such as rotational and traversal speeds, the number of FSP passes, and the pin profile as well as the characteristics of SiC powder are discussed in detail with regard to macro- and microstructure, hardness, strength, tribological, and electrical properties of FSPed Cu–SiC composites. |
| first_indexed | 2024-03-07T23:23:54Z |
| format | Article |
| id | doaj.art-7ddad67688a645dfa3f3f6449aaacb50 |
| institution | Directory Open Access Journal |
| issn | 2238-7854 |
| language | English |
| last_indexed | 2024-03-07T23:23:54Z |
| publishDate | 2023-11-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj.art-7ddad67688a645dfa3f3f6449aaacb502024-02-21T05:25:02ZengElsevierJournal of Materials Research and Technology2238-78542023-11-012713171349An overview of friction stir processing of Cu–SiC composites: Microstructural, mechanical, tribological, and electrical propertiesMohammad Reza Akbarpour0Homayoun Mousa Mirabad1Farid Gazani2Iman Khezri3Amirhossein Ahmadi Chadegani4Ali Moeini5Hyoung Seop Kim6Department of Materials Engineering, University of Maragheh, Maragheh, East Azerbaijan, Iran; Corresponding author.Department of Materials Science and Engineering, Sharif University of Technology, P.O. Box 11365-9466, Tehran, IranDepartment of Materials Science and Engineering, Sharif University of Technology, P.O. Box 11365-9466, Tehran, IranDepartment of Materials Science and Engineering, Sharif University of Technology, P.O. Box 11365-9466, Tehran, IranDepartment of Materials Science and Engineering, Sharif University of Technology, P.O. Box 11365-9466, Tehran, IranDepartment of Materials Engineering, Isfahan University of Technology, 84156-83111 Isfahan, IranDepartment of Materials Science and Engineering, Pohang University of Science and Technology, Pohang 790-784, South Korea; Advanced Institute for Materials Research (WPI-AIMR), Tohoku University, Sendai 980-8577, Japan; Institute for Convergence Research and Education in Advanced Technology, Yonsei University, Seoul 03722, South Korea; Corresponding author. Department of Materials Science and Engineering, Pohang University of Science and Technology, Pohang 790-784, South Korea.Copper matrix composite reinforced with SiC exhibits high electrical and thermal conductivity, as well as superior mechanical properties, making it a potential candidate for thermal management applications. There has been rapid progress in the understanding of Cu–SiC metal matrix composites during the past decade. To accomplish this, powder metallurgy, casting, selective laser melting, composite electroforming technology, and electrodeposition methods have been employed. The optimum cutting conditions for fabrication of Cu–SiC metal matrix composites are still being explored. In recent years, friction stir processing (FSP) has become increasingly popular in the fabrication of composites. FSP is capable of microstructural engineering in Cu–SiC systems. In light of the fact that the electrical/thermal conductivity and mechanical performance of Cu–SiC composites depend on microstructural characteristics such as SiC distribution, grain size, grain orientation, density of dislocations, and bulk density, it seems important to study the effect of manufacturing conditions on microstructure in detail. In this study, the influence of FSP parameters such as rotational and traversal speeds, the number of FSP passes, and the pin profile as well as the characteristics of SiC powder are discussed in detail with regard to macro- and microstructure, hardness, strength, tribological, and electrical properties of FSPed Cu–SiC composites.http://www.sciencedirect.com/science/article/pii/S2238785423023268CopperFriction stir processingCompositesSiCMechanical properties |
| spellingShingle | Mohammad Reza Akbarpour Homayoun Mousa Mirabad Farid Gazani Iman Khezri Amirhossein Ahmadi Chadegani Ali Moeini Hyoung Seop Kim An overview of friction stir processing of Cu–SiC composites: Microstructural, mechanical, tribological, and electrical properties Journal of Materials Research and Technology Copper Friction stir processing Composites SiC Mechanical properties |
| title | An overview of friction stir processing of Cu–SiC composites: Microstructural, mechanical, tribological, and electrical properties |
| title_full | An overview of friction stir processing of Cu–SiC composites: Microstructural, mechanical, tribological, and electrical properties |
| title_fullStr | An overview of friction stir processing of Cu–SiC composites: Microstructural, mechanical, tribological, and electrical properties |
| title_full_unstemmed | An overview of friction stir processing of Cu–SiC composites: Microstructural, mechanical, tribological, and electrical properties |
| title_short | An overview of friction stir processing of Cu–SiC composites: Microstructural, mechanical, tribological, and electrical properties |
| title_sort | overview of friction stir processing of cu sic composites microstructural mechanical tribological and electrical properties |
| topic | Copper Friction stir processing Composites SiC Mechanical properties |
| url | http://www.sciencedirect.com/science/article/pii/S2238785423023268 |
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