APA (7. basım) Alıntı

Schwenck, A., Grözinger, T., Günther, T., Schumacher, A., Schuhmacher, D., Werum, K., & Zimmermann, A. (2021). Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane. MDPI AG.

Chicago Style (17. basım) Atıf

Schwenck, Adrian, Tobias Grözinger, Thomas Günther, Axel Schumacher, Dietmar Schuhmacher, Kai Werum, ve André Zimmermann. Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane. MDPI AG, 2021.

MLA (9th ed.) Atıf

Schwenck, Adrian, et al. Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane. MDPI AG, 2021.