Παραπομπή σε μορφή APA (7η εκδ.)

Schwenck, A., Grözinger, T., Günther, T., Schumacher, A., Schuhmacher, D., Werum, K., & Zimmermann, A. (2021). Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane. MDPI AG.

Παραπομπή σε μορφή Chicago (17η εκδ.)

Schwenck, Adrian, Tobias Grözinger, Thomas Günther, Axel Schumacher, Dietmar Schuhmacher, Kai Werum, και André Zimmermann. Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane. MDPI AG, 2021.

Παραπομπή σε μορφή MLA (9th εκδ.)

Schwenck, Adrian, et al. Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane. MDPI AG, 2021.