Cita APA (7a ed.)

Schwenck, A., Grözinger, T., Günther, T., Schumacher, A., Schuhmacher, D., Werum, K., & Zimmermann, A. (2021). Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane. MDPI AG.

Cita Chicago Style (17a ed.)

Schwenck, Adrian, Tobias Grözinger, Thomas Günther, Axel Schumacher, Dietmar Schuhmacher, Kai Werum, y André Zimmermann. Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane. MDPI AG, 2021.

Cita MLA (9a ed.)

Schwenck, Adrian, et al. Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane. MDPI AG, 2021.