Schwenck, A., Grözinger, T., Günther, T., Schumacher, A., Schuhmacher, D., Werum, K., & Zimmermann, A. (2021). Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane. MDPI AG.
शिकागो शैली (17वां संस्करण) प्रशस्ति पत्रSchwenck, Adrian, Tobias Grözinger, Thomas Günther, Axel Schumacher, Dietmar Schuhmacher, Kai Werum, और André Zimmermann. Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane. MDPI AG, 2021.
एमएलए (9वां संस्करण) प्रशस्ति पत्रSchwenck, Adrian, et al. Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane. MDPI AG, 2021.
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