Schwenck, A., Grözinger, T., Günther, T., Schumacher, A., Schuhmacher, D., Werum, K., & Zimmermann, A. (2021). Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane. MDPI AG.
芝加哥风格引文Schwenck, Adrian, Tobias Grözinger, Thomas Günther, Axel Schumacher, Dietmar Schuhmacher, Kai Werum, 与 André Zimmermann. Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane. MDPI AG, 2021.
MLA引文Schwenck, Adrian, et al. Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane. MDPI AG, 2021.
警告：这些引文格式不一定是100％准确.