Design method of thermal connector for electronic equipment cooling
We have developed the evaluation method for two performance factors to design the thermal connector: Insertion force of thermal grease and thermal conductance. The thermal connector was comprised of a thermal plug and a thermal socket, and the thermal grease which was filled into the gap between the...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | Japanese |
| Published: |
The Japan Society of Mechanical Engineers
2017-05-01
|
| Series: | Nihon Kikai Gakkai ronbunshu |
| Subjects: | |
| Online Access: | https://www.jstage.jst.go.jp/article/transjsme/83/850/83_16-00580/_pdf/-char/en |
| _version_ | 1811221161219981312 |
|---|---|
| author | Tomoo HAYASHI Yoshihiro KONDO Hiroyuki TOYODA Shigemasa SATO Shigeyasu TSUBAKI |
| author_facet | Tomoo HAYASHI Yoshihiro KONDO Hiroyuki TOYODA Shigemasa SATO Shigeyasu TSUBAKI |
| author_sort | Tomoo HAYASHI |
| collection | DOAJ |
| description | We have developed the evaluation method for two performance factors to design the thermal connector: Insertion force of thermal grease and thermal conductance. The thermal connector was comprised of a thermal plug and a thermal socket, and the thermal grease which was filled into the gap between the thermal plug and the thermal socket connected the thermal plug and the thermal socket thermally. Firstly, the insertion force was theoretically calculated using the Bingham plastic model for rheology characteristics of the thermal grease and the slip model on the surfaces of the thermal plug and the thermal socket. The calculated results were in good agreement with the experimental results. Secondly, the experimental results of the thermal conductance between the thermal plug and the thermal sockets at the first connection to the 20 times connection were -1 to +26 percent greater than the theoretical value. The reason why some experimental results exceed the theoretical results is the eccentricity between the thermal plug and the thermal socket. In addition, the filling status of the thermal grease in the gap was visualized by ultrasonic testing. The results after the 20 times connections showed there were some voids in the thermal grease and the area of voids was 4 percent of the heat transfer area. Therefore, the thermal conductance was mostly not influenced by the voids. Finally, it was found that the proposed methods to predict the insertion force and thermal conductance were reasonable. |
| first_indexed | 2024-04-12T07:54:36Z |
| format | Article |
| id | doaj.art-7fc56c436591419cbce8bfc54de56dec |
| institution | Directory Open Access Journal |
| issn | 2187-9761 |
| language | Japanese |
| last_indexed | 2024-04-12T07:54:36Z |
| publishDate | 2017-05-01 |
| publisher | The Japan Society of Mechanical Engineers |
| record_format | Article |
| series | Nihon Kikai Gakkai ronbunshu |
| spelling | doaj.art-7fc56c436591419cbce8bfc54de56dec2022-12-22T03:41:31ZjpnThe Japan Society of Mechanical EngineersNihon Kikai Gakkai ronbunshu2187-97612017-05-018385016-0058016-0058010.1299/transjsme.16-00580transjsmeDesign method of thermal connector for electronic equipment coolingTomoo HAYASHI0Yoshihiro KONDO1Hiroyuki TOYODA2Shigemasa SATO3Shigeyasu TSUBAKI4Center for Technology Innovation - Mechanical Engineering, Research and Development Group, Hitachi, Ltd.Center for Technology Innovation - Mechanical Engineering, Research and Development Group, Hitachi, Ltd.Center for Technology Innovation - Mechanical Engineering, Research and Development Group, Hitachi, Ltd.Information & Communication Technology Business Division, Hitachi, Ltd.Information & Communication Technology Business Division, Hitachi, Ltd.We have developed the evaluation method for two performance factors to design the thermal connector: Insertion force of thermal grease and thermal conductance. The thermal connector was comprised of a thermal plug and a thermal socket, and the thermal grease which was filled into the gap between the thermal plug and the thermal socket connected the thermal plug and the thermal socket thermally. Firstly, the insertion force was theoretically calculated using the Bingham plastic model for rheology characteristics of the thermal grease and the slip model on the surfaces of the thermal plug and the thermal socket. The calculated results were in good agreement with the experimental results. Secondly, the experimental results of the thermal conductance between the thermal plug and the thermal sockets at the first connection to the 20 times connection were -1 to +26 percent greater than the theoretical value. The reason why some experimental results exceed the theoretical results is the eccentricity between the thermal plug and the thermal socket. In addition, the filling status of the thermal grease in the gap was visualized by ultrasonic testing. The results after the 20 times connections showed there were some voids in the thermal grease and the area of voids was 4 percent of the heat transfer area. Therefore, the thermal conductance was mostly not influenced by the voids. Finally, it was found that the proposed methods to predict the insertion force and thermal conductance were reasonable.https://www.jstage.jst.go.jp/article/transjsme/83/850/83_16-00580/_pdf/-char/enthermal connectorthermal greasethermal conductancepressure dropbingham plastic modelslip |
| spellingShingle | Tomoo HAYASHI Yoshihiro KONDO Hiroyuki TOYODA Shigemasa SATO Shigeyasu TSUBAKI Design method of thermal connector for electronic equipment cooling Nihon Kikai Gakkai ronbunshu thermal connector thermal grease thermal conductance pressure drop bingham plastic model slip |
| title | Design method of thermal connector for electronic equipment cooling |
| title_full | Design method of thermal connector for electronic equipment cooling |
| title_fullStr | Design method of thermal connector for electronic equipment cooling |
| title_full_unstemmed | Design method of thermal connector for electronic equipment cooling |
| title_short | Design method of thermal connector for electronic equipment cooling |
| title_sort | design method of thermal connector for electronic equipment cooling |
| topic | thermal connector thermal grease thermal conductance pressure drop bingham plastic model slip |
| url | https://www.jstage.jst.go.jp/article/transjsme/83/850/83_16-00580/_pdf/-char/en |
| work_keys_str_mv | AT tomoohayashi designmethodofthermalconnectorforelectronicequipmentcooling AT yoshihirokondo designmethodofthermalconnectorforelectronicequipmentcooling AT hiroyukitoyoda designmethodofthermalconnectorforelectronicequipmentcooling AT shigemasasato designmethodofthermalconnectorforelectronicequipmentcooling AT shigeyasutsubaki designmethodofthermalconnectorforelectronicequipmentcooling |