Effects of Deep Cryogenic Treatment on the Microstructure and Properties of Rolled Cu Foil
The development of fifth-generation (5G) communication and wearable electronics generates higher requirements for the mechanical properties of copper foil. Higher mechanical properties and lower resistance are required for flexible copper-clad laminate and high-frequency and high-speed Cu foil. Deep...
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MDPI AG
2021-09-01
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| Series: | Materials |
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| Online Access: | https://www.mdpi.com/1996-1944/14/19/5498 |
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| author | Zhichao Dong Xiangyu Fei Benkui Gong Xinyu Zhao Jiwei Nie |
| author_facet | Zhichao Dong Xiangyu Fei Benkui Gong Xinyu Zhao Jiwei Nie |
| author_sort | Zhichao Dong |
| collection | DOAJ |
| description | The development of fifth-generation (5G) communication and wearable electronics generates higher requirements for the mechanical properties of copper foil. Higher mechanical properties and lower resistance are required for flexible copper-clad laminate and high-frequency and high-speed Cu foil. Deep cryogenic treatment (DCT), as a post-treatment method, has many advantages, such as low cost and ease of operation. However, less attention has been paid to the impact of DCT on rolled Cu foil. In this study, the effects of DCT on the microstructure and mechanical properties of rolled Cu foil were investigated. The results show that as the treatment time increased, the tensile strength and hardness first increased and then decreased, reaching a peak value of 394.06 MPa and 1.47 GPa at 12 h. The mechanical property improvement of rolled Cu foil was due to the grain refinement and the increase of dislocation density. The dislocation density of rolled Cu foil after a DCT time of 12 h was determined to have a peak value of 4.3798 × 10<sup>15</sup> m<sup>−2</sup>. The dislocation density increased by 19% and the grain size decreased by 12% after 12 h DCT. |
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| id | doaj.art-7fea5d26f3a94f1282682c7f6d42288e |
| institution | Directory Open Access Journal |
| issn | 1996-1944 |
| language | English |
| last_indexed | 2024-03-10T06:57:03Z |
| publishDate | 2021-09-01 |
| publisher | MDPI AG |
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| series | Materials |
| spelling | doaj.art-7fea5d26f3a94f1282682c7f6d42288e2023-11-22T16:22:44ZengMDPI AGMaterials1996-19442021-09-011419549810.3390/ma14195498Effects of Deep Cryogenic Treatment on the Microstructure and Properties of Rolled Cu FoilZhichao Dong0Xiangyu Fei1Benkui Gong2Xinyu Zhao3Jiwei Nie4School of Materials Science and Engineering, Shandong University of Technology, Zibo 255049, ChinaSchool of Materials Science and Engineering, Shandong University of Technology, Zibo 255049, ChinaSchool of Materials Science and Engineering, Shandong University of Technology, Zibo 255049, ChinaSchool of Materials Science and Engineering, Shandong University of Technology, Zibo 255049, ChinaSchool of Materials Science and Engineering, Shandong University of Technology, Zibo 255049, ChinaThe development of fifth-generation (5G) communication and wearable electronics generates higher requirements for the mechanical properties of copper foil. Higher mechanical properties and lower resistance are required for flexible copper-clad laminate and high-frequency and high-speed Cu foil. Deep cryogenic treatment (DCT), as a post-treatment method, has many advantages, such as low cost and ease of operation. However, less attention has been paid to the impact of DCT on rolled Cu foil. In this study, the effects of DCT on the microstructure and mechanical properties of rolled Cu foil were investigated. The results show that as the treatment time increased, the tensile strength and hardness first increased and then decreased, reaching a peak value of 394.06 MPa and 1.47 GPa at 12 h. The mechanical property improvement of rolled Cu foil was due to the grain refinement and the increase of dislocation density. The dislocation density of rolled Cu foil after a DCT time of 12 h was determined to have a peak value of 4.3798 × 10<sup>15</sup> m<sup>−2</sup>. The dislocation density increased by 19% and the grain size decreased by 12% after 12 h DCT.https://www.mdpi.com/1996-1944/14/19/5498rolled Cu foildeep cryogenic treatmentmicrostructuremechanical propertiescorrosion resistance |
| spellingShingle | Zhichao Dong Xiangyu Fei Benkui Gong Xinyu Zhao Jiwei Nie Effects of Deep Cryogenic Treatment on the Microstructure and Properties of Rolled Cu Foil Materials rolled Cu foil deep cryogenic treatment microstructure mechanical properties corrosion resistance |
| title | Effects of Deep Cryogenic Treatment on the Microstructure and Properties of Rolled Cu Foil |
| title_full | Effects of Deep Cryogenic Treatment on the Microstructure and Properties of Rolled Cu Foil |
| title_fullStr | Effects of Deep Cryogenic Treatment on the Microstructure and Properties of Rolled Cu Foil |
| title_full_unstemmed | Effects of Deep Cryogenic Treatment on the Microstructure and Properties of Rolled Cu Foil |
| title_short | Effects of Deep Cryogenic Treatment on the Microstructure and Properties of Rolled Cu Foil |
| title_sort | effects of deep cryogenic treatment on the microstructure and properties of rolled cu foil |
| topic | rolled Cu foil deep cryogenic treatment microstructure mechanical properties corrosion resistance |
| url | https://www.mdpi.com/1996-1944/14/19/5498 |
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