Effects of Deep Cryogenic Treatment on the Microstructure and Properties of Rolled Cu Foil
The development of fifth-generation (5G) communication and wearable electronics generates higher requirements for the mechanical properties of copper foil. Higher mechanical properties and lower resistance are required for flexible copper-clad laminate and high-frequency and high-speed Cu foil. Deep...
Main Authors: | Zhichao Dong, Xiangyu Fei, Benkui Gong, Xinyu Zhao, Jiwei Nie |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2021-09-01
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Series: | Materials |
Subjects: | |
Online Access: | https://www.mdpi.com/1996-1944/14/19/5498 |
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