RLARA: A TSV-Aware Reinforcement Learning Assisted Fault-Tolerant Routing Algorithm for 3D Network-on-Chip

RLARA: A TSV-Aware Reinforcement Learning Assisted Fault-Tolerant Routing Algorithm for 3D Network-on-Chip

A three-dimensional Network-on-Chip (3D NoC) equips modern multicore processors with good scalability, a small area, and high performance using vertical through-silicon vias (TSV). However, the failure rate of TSV, which is higher than that of horizontal links, causes unpredictable topology variatio...

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Bibliographic Details
Main Authors:	Jiajia Jiao, Ruirui Shen, Lujian Chen, Jin Liu, Dezhi Han
Format:	Article
Language:	English
Published:	MDPI AG 2023-12-01
Series:	Electronics
Subjects:	deadlock mitigation fault tolerance K-means clustering through silicon vias 3D network-on-chip reinforcement learning
Online Access:	https://www.mdpi.com/2079-9292/12/23/4867

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