Parametric Compact Thermal Models of Power LEDs
Light-emitting diodes are nowadays the most dynamically developing type of light sources. Considering that temperature is the main factor affecting the electrical and lighting parameters of these devices, thermal models are essential subcomponents of the multidomain models commonly used for simulati...
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MDPI AG
2019-05-01
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Series: | Energies |
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Online Access: | https://www.mdpi.com/1996-1073/12/9/1724 |
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author | Marcin Janicki Tomasz Torzewicz Przemysław Ptak Tomasz Raszkowski Agnieszka Samson Krzysztof Górecki |
author_facet | Marcin Janicki Tomasz Torzewicz Przemysław Ptak Tomasz Raszkowski Agnieszka Samson Krzysztof Górecki |
author_sort | Marcin Janicki |
collection | DOAJ |
description | Light-emitting diodes are nowadays the most dynamically developing type of light sources. Considering that temperature is the main factor affecting the electrical and lighting parameters of these devices, thermal models are essential subcomponents of the multidomain models commonly used for simulation of their operation. The authors investigated white power light-emitting diodes soldered to Metal Core Printed Circuit Boards (MCPCBs). The tested devices were placed in a light-tight box on a cold plate and their cooling curves were registered for different diode heating current values and various preset cold plate temperatures. These data allowed the computation of optical and real heating power values and consequently the generation of compact thermal models in the form of Foster and Cauer RC ladders. This also rendered possible the analysis of the influence of the considered factors on the compact model element values and their parametrization. The resulting models yield accurate values of diode junction temperature in most realistic operating conditions and they can be easily included in multidomain compact models of power light emitting diodes. |
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format | Article |
id | doaj.art-80cadf79427540babdb0ed7ec622e7e7 |
institution | Directory Open Access Journal |
issn | 1996-1073 |
language | English |
last_indexed | 2024-04-11T22:16:25Z |
publishDate | 2019-05-01 |
publisher | MDPI AG |
record_format | Article |
series | Energies |
spelling | doaj.art-80cadf79427540babdb0ed7ec622e7e72022-12-22T04:00:22ZengMDPI AGEnergies1996-10732019-05-01129172410.3390/en12091724en12091724Parametric Compact Thermal Models of Power LEDsMarcin Janicki0Tomasz Torzewicz1Przemysław Ptak2Tomasz Raszkowski3Agnieszka Samson4Krzysztof Górecki5Department Microelectronics and Computer Science, Lodz University of Technology, Łódź, Wólczańska 221/223, 90-924 Łódź, PolandDepartment Microelectronics and Computer Science, Lodz University of Technology, Łódź, Wólczańska 221/223, 90-924 Łódź, PolandDepartment of Marine Electronics, Gdynia Maritime University, Gdynia, Morska 81-87, 81-225 Gdynia, PolandDepartment Microelectronics and Computer Science, Lodz University of Technology, Łódź, Wólczańska 221/223, 90-924 Łódź, PolandDepartment Microelectronics and Computer Science, Lodz University of Technology, Łódź, Wólczańska 221/223, 90-924 Łódź, PolandDepartment of Marine Electronics, Gdynia Maritime University, Gdynia, Morska 81-87, 81-225 Gdynia, PolandLight-emitting diodes are nowadays the most dynamically developing type of light sources. Considering that temperature is the main factor affecting the electrical and lighting parameters of these devices, thermal models are essential subcomponents of the multidomain models commonly used for simulation of their operation. The authors investigated white power light-emitting diodes soldered to Metal Core Printed Circuit Boards (MCPCBs). The tested devices were placed in a light-tight box on a cold plate and their cooling curves were registered for different diode heating current values and various preset cold plate temperatures. These data allowed the computation of optical and real heating power values and consequently the generation of compact thermal models in the form of Foster and Cauer RC ladders. This also rendered possible the analysis of the influence of the considered factors on the compact model element values and their parametrization. The resulting models yield accurate values of diode junction temperature in most realistic operating conditions and they can be easily included in multidomain compact models of power light emitting diodes.https://www.mdpi.com/1996-1073/12/9/1724LED compact thermal modelsheating and optical powerCauer RC ladder |
spellingShingle | Marcin Janicki Tomasz Torzewicz Przemysław Ptak Tomasz Raszkowski Agnieszka Samson Krzysztof Górecki Parametric Compact Thermal Models of Power LEDs Energies LED compact thermal models heating and optical power Cauer RC ladder |
title | Parametric Compact Thermal Models of Power LEDs |
title_full | Parametric Compact Thermal Models of Power LEDs |
title_fullStr | Parametric Compact Thermal Models of Power LEDs |
title_full_unstemmed | Parametric Compact Thermal Models of Power LEDs |
title_short | Parametric Compact Thermal Models of Power LEDs |
title_sort | parametric compact thermal models of power leds |
topic | LED compact thermal models heating and optical power Cauer RC ladder |
url | https://www.mdpi.com/1996-1073/12/9/1724 |
work_keys_str_mv | AT marcinjanicki parametriccompactthermalmodelsofpowerleds AT tomasztorzewicz parametriccompactthermalmodelsofpowerleds AT przemysławptak parametriccompactthermalmodelsofpowerleds AT tomaszraszkowski parametriccompactthermalmodelsofpowerleds AT agnieszkasamson parametriccompactthermalmodelsofpowerleds AT krzysztofgorecki parametriccompactthermalmodelsofpowerleds |