Compact Thermal Modeling of Modules Containing Multiple Power LEDs
Temperature is an essential factor affecting the operation of light-emitting diodes (LEDs), which are often used in circuits containing multiple devices influencing each other. Therefore, the thermal models of such circuits should take into account not only the self-heating effects, but also the mut...
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| Format: | Article |
| Language: | English |
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MDPI AG
2020-06-01
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| Series: | Energies |
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| Online Access: | https://www.mdpi.com/1996-1073/13/12/3130 |
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| author | Marcin Janicki Przemysław Ptak Tomasz Torzewicz Krzysztof Górecki |
| author_facet | Marcin Janicki Przemysław Ptak Tomasz Torzewicz Krzysztof Górecki |
| author_sort | Marcin Janicki |
| collection | DOAJ |
| description | Temperature is an essential factor affecting the operation of light-emitting diodes (LEDs), which are often used in circuits containing multiple devices influencing each other. Therefore, the thermal models of such circuits should take into account not only the self-heating effects, but also the mutual thermal influences among devices. This problem is illustrated here based on the example of a module containing six LEDs forming on the substrate a hexagon. This module is supposed to operate without any heat sink in the natural convection cooling conditions, hence it has been proposed to increase the thermal pad area in order to lower the device-operating temperature. In the experimental part of the paper, the recorded diode-heating curves are processed using the network identification by deconvolution method. This allows for the computation of the thermal time constant spectra and the generation of device-compact thermal models. Moreover, the influence of the thermal pad surface area on the device temperature and the thermal coupling between LEDs is investigated. |
| first_indexed | 2024-03-10T19:07:11Z |
| format | Article |
| id | doaj.art-8168495234984fae80f0c9537fd03b07 |
| institution | Directory Open Access Journal |
| issn | 1996-1073 |
| language | English |
| last_indexed | 2024-03-10T19:07:11Z |
| publishDate | 2020-06-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Energies |
| spelling | doaj.art-8168495234984fae80f0c9537fd03b072023-11-20T04:04:12ZengMDPI AGEnergies1996-10732020-06-011312313010.3390/en13123130Compact Thermal Modeling of Modules Containing Multiple Power LEDsMarcin Janicki0Przemysław Ptak1Tomasz Torzewicz2Krzysztof Górecki3Department of Microelectronics and Computer Science, Lodz University of Technology, 90-924 Łódź, PolandDepartment of Marine Electronics, Gdynia Maritime University, 81-255 Gdynia, PolandDepartment of Microelectronics and Computer Science, Lodz University of Technology, 90-924 Łódź, PolandDepartment of Marine Electronics, Gdynia Maritime University, 81-255 Gdynia, PolandTemperature is an essential factor affecting the operation of light-emitting diodes (LEDs), which are often used in circuits containing multiple devices influencing each other. Therefore, the thermal models of such circuits should take into account not only the self-heating effects, but also the mutual thermal influences among devices. This problem is illustrated here based on the example of a module containing six LEDs forming on the substrate a hexagon. This module is supposed to operate without any heat sink in the natural convection cooling conditions, hence it has been proposed to increase the thermal pad area in order to lower the device-operating temperature. In the experimental part of the paper, the recorded diode-heating curves are processed using the network identification by deconvolution method. This allows for the computation of the thermal time constant spectra and the generation of device-compact thermal models. Moreover, the influence of the thermal pad surface area on the device temperature and the thermal coupling between LEDs is investigated.https://www.mdpi.com/1996-1073/13/12/3130multi-LED lighting modulesdevice thermal couplingcompact thermal models |
| spellingShingle | Marcin Janicki Przemysław Ptak Tomasz Torzewicz Krzysztof Górecki Compact Thermal Modeling of Modules Containing Multiple Power LEDs Energies multi-LED lighting modules device thermal coupling compact thermal models |
| title | Compact Thermal Modeling of Modules Containing Multiple Power LEDs |
| title_full | Compact Thermal Modeling of Modules Containing Multiple Power LEDs |
| title_fullStr | Compact Thermal Modeling of Modules Containing Multiple Power LEDs |
| title_full_unstemmed | Compact Thermal Modeling of Modules Containing Multiple Power LEDs |
| title_short | Compact Thermal Modeling of Modules Containing Multiple Power LEDs |
| title_sort | compact thermal modeling of modules containing multiple power leds |
| topic | multi-LED lighting modules device thermal coupling compact thermal models |
| url | https://www.mdpi.com/1996-1073/13/12/3130 |
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