Investigation of Terahertz 3D EM Simulation on Device Modeling and A New InP HBT Dispersive Inter-Electrode Impedance Extraction Method

In this paper, a new 3-D electromagnetic (EM) simulation approach for heterojunction bipolar transistor (HBT) parameter extraction in terahertz band is presented. We introduce an inter-electrode impedance equivalent-circuit model with the concept of dispersive parameters and a more rigorous 3-D EM s...

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Main Authors: Yapei Chen, Yong Zhang, Yuehang Xu, Yan Sun, Wei Cheng, Haiyan Lu, Fei Xiao, Ruimin Xu
Format: Article
Language:English
Published: IEEE 2018-01-01
Series:IEEE Access
Subjects:
Online Access:https://ieeexplore.ieee.org/document/8438870/
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author Yapei Chen
Yong Zhang
Yuehang Xu
Yan Sun
Wei Cheng
Haiyan Lu
Fei Xiao
Ruimin Xu
author_facet Yapei Chen
Yong Zhang
Yuehang Xu
Yan Sun
Wei Cheng
Haiyan Lu
Fei Xiao
Ruimin Xu
author_sort Yapei Chen
collection DOAJ
description In this paper, a new 3-D electromagnetic (EM) simulation approach for heterojunction bipolar transistor (HBT) parameter extraction in terahertz band is presented. We introduce an inter-electrode impedance equivalent-circuit model with the concept of dispersive parameters and a more rigorous 3-D EM simulation parameter extraction method to avoid serious discrepancies between the simulated EM field distribution and the real EM field distribution of the device. Terahertz parasitic effects, including the EM field discretization and multi-finger device field sharing, are observed. Compared with the previous 3-D EM simulation-assisted model, the new model in this paper demonstrates better results for multi-finger indium phosphide HBTs.
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spelling doaj.art-829a230d80db48f59b41c5d297fa7f222022-12-21T20:01:52ZengIEEEIEEE Access2169-35362018-01-016457724578110.1109/ACCESS.2018.28659298438870Investigation of Terahertz 3D EM Simulation on Device Modeling and A New InP HBT Dispersive Inter-Electrode Impedance Extraction MethodYapei Chen0https://orcid.org/0000-0003-3123-3547Yong Zhang1Yuehang Xu2https://orcid.org/0000-0003-1706-2681Yan Sun3Wei Cheng4Haiyan Lu5Fei Xiao6Ruimin Xu7EHF Key Laboratory of Fundamental Science, University of Electronic Science and Technology of China, Chengdu, ChinaEHF Key Laboratory of Fundamental Science, University of Electronic Science and Technology of China, Chengdu, ChinaEHF Key Laboratory of Fundamental Science, University of Electronic Science and Technology of China, Chengdu, ChinaScience and Technology on Monolithic Integrated Circuits and Modules Laboratory, Nanjing Electronic Devices Institute, Nanjing, ChinaScience and Technology on Monolithic Integrated Circuits and Modules Laboratory, Nanjing Electronic Devices Institute, Nanjing, ChinaScience and Technology on Monolithic Integrated Circuits and Modules Laboratory, Nanjing Electronic Devices Institute, Nanjing, ChinaEHF Key Laboratory of Fundamental Science, University of Electronic Science and Technology of China, Chengdu, ChinaEHF Key Laboratory of Fundamental Science, University of Electronic Science and Technology of China, Chengdu, ChinaIn this paper, a new 3-D electromagnetic (EM) simulation approach for heterojunction bipolar transistor (HBT) parameter extraction in terahertz band is presented. We introduce an inter-electrode impedance equivalent-circuit model with the concept of dispersive parameters and a more rigorous 3-D EM simulation parameter extraction method to avoid serious discrepancies between the simulated EM field distribution and the real EM field distribution of the device. Terahertz parasitic effects, including the EM field discretization and multi-finger device field sharing, are observed. Compared with the previous 3-D EM simulation-assisted model, the new model in this paper demonstrates better results for multi-finger indium phosphide HBTs.https://ieeexplore.ieee.org/document/8438870/InP HBTterahertz band3D EM simulationtransistor model
spellingShingle Yapei Chen
Yong Zhang
Yuehang Xu
Yan Sun
Wei Cheng
Haiyan Lu
Fei Xiao
Ruimin Xu
Investigation of Terahertz 3D EM Simulation on Device Modeling and A New InP HBT Dispersive Inter-Electrode Impedance Extraction Method
IEEE Access
InP HBT
terahertz band
3D EM simulation
transistor model
title Investigation of Terahertz 3D EM Simulation on Device Modeling and A New InP HBT Dispersive Inter-Electrode Impedance Extraction Method
title_full Investigation of Terahertz 3D EM Simulation on Device Modeling and A New InP HBT Dispersive Inter-Electrode Impedance Extraction Method
title_fullStr Investigation of Terahertz 3D EM Simulation on Device Modeling and A New InP HBT Dispersive Inter-Electrode Impedance Extraction Method
title_full_unstemmed Investigation of Terahertz 3D EM Simulation on Device Modeling and A New InP HBT Dispersive Inter-Electrode Impedance Extraction Method
title_short Investigation of Terahertz 3D EM Simulation on Device Modeling and A New InP HBT Dispersive Inter-Electrode Impedance Extraction Method
title_sort investigation of terahertz 3d em simulation on device modeling and a new inp hbt dispersive inter electrode impedance extraction method
topic InP HBT
terahertz band
3D EM simulation
transistor model
url https://ieeexplore.ieee.org/document/8438870/
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