Electronic‐photonic board as an integration platform for Tb/s multi‐chip optical communication
Abstract Chip‐on‐board silicon photonics O‐band wavelength‐division multiplexing transceivers have been developed that will eventually enable high‐throughput on‐board optical communication for multi‐socket on‐board communication. This direct, any‐to‐any configuration yields low‐latency, low‐power op...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2021-04-01
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| Series: | IET Optoelectronics |
| Subjects: | |
| Online Access: | https://doi.org/10.1049/ote2.12017 |
| _version_ | 1797983854587281408 |
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| author | Tobias Lamprecht Felix Betschon Johan Bauwelinck Joris Van Kerrebrouck Joris Lambrecht Holger Gaul Alexander Eichler Xin Yin |
| author_facet | Tobias Lamprecht Felix Betschon Johan Bauwelinck Joris Van Kerrebrouck Joris Lambrecht Holger Gaul Alexander Eichler Xin Yin |
| author_sort | Tobias Lamprecht |
| collection | DOAJ |
| description | Abstract Chip‐on‐board silicon photonics O‐band wavelength‐division multiplexing transceivers have been developed that will eventually enable high‐throughput on‐board optical communication for multi‐socket on‐board communication. This direct, any‐to‐any configuration yields low‐latency, low‐power optical communication among multiple compute nodes on the board. Silicon photonic transceiver chips are flip‐chipped on a polymer waveguide containing an electro‐optical circuit board using adiabatic coupling and then completed with driver and amplifier electronic chips. A transceiver assembly based on wire‐bond technology verifies 50 Gb/s operation per channel, and the flip‐chip version demonstrates the chip on‐board assembly techniques for compact on‐board transceivers. |
| first_indexed | 2024-04-11T06:53:31Z |
| format | Article |
| id | doaj.art-82ae20652f494373b66a7e3ef55d84a6 |
| institution | Directory Open Access Journal |
| issn | 1751-8768 1751-8776 |
| language | English |
| last_indexed | 2024-04-11T06:53:31Z |
| publishDate | 2021-04-01 |
| publisher | Wiley |
| record_format | Article |
| series | IET Optoelectronics |
| spelling | doaj.art-82ae20652f494373b66a7e3ef55d84a62022-12-22T04:39:07ZengWileyIET Optoelectronics1751-87681751-87762021-04-011529210110.1049/ote2.12017Electronic‐photonic board as an integration platform for Tb/s multi‐chip optical communicationTobias Lamprecht0Felix Betschon1Johan Bauwelinck2Joris Van Kerrebrouck3Joris Lambrecht4Holger Gaul5Alexander Eichler6Xin Yin7Vario‐optics AG Heiden SwitzerlandVario‐optics AG Heiden SwitzerlandIDLab imec ‐ Ghent University Ghent BelgiumIDLab imec ‐ Ghent University Ghent BelgiumIDLab imec ‐ Ghent University Ghent BelgiumAmphenol Active Optics Products / FCI Berlin GermanyAmphenol Active Optics Products / FCI Berlin GermanyIDLab imec ‐ Ghent University Ghent BelgiumAbstract Chip‐on‐board silicon photonics O‐band wavelength‐division multiplexing transceivers have been developed that will eventually enable high‐throughput on‐board optical communication for multi‐socket on‐board communication. This direct, any‐to‐any configuration yields low‐latency, low‐power optical communication among multiple compute nodes on the board. Silicon photonic transceiver chips are flip‐chipped on a polymer waveguide containing an electro‐optical circuit board using adiabatic coupling and then completed with driver and amplifier electronic chips. A transceiver assembly based on wire‐bond technology verifies 50 Gb/s operation per channel, and the flip‐chip version demonstrates the chip on‐board assembly techniques for compact on‐board transceivers.https://doi.org/10.1049/ote2.12017electro‐optical deviceselemental semiconductorsflip‐chip devicesintegrated opticsoptical polymersoptical switches |
| spellingShingle | Tobias Lamprecht Felix Betschon Johan Bauwelinck Joris Van Kerrebrouck Joris Lambrecht Holger Gaul Alexander Eichler Xin Yin Electronic‐photonic board as an integration platform for Tb/s multi‐chip optical communication IET Optoelectronics electro‐optical devices elemental semiconductors flip‐chip devices integrated optics optical polymers optical switches |
| title | Electronic‐photonic board as an integration platform for Tb/s multi‐chip optical communication |
| title_full | Electronic‐photonic board as an integration platform for Tb/s multi‐chip optical communication |
| title_fullStr | Electronic‐photonic board as an integration platform for Tb/s multi‐chip optical communication |
| title_full_unstemmed | Electronic‐photonic board as an integration platform for Tb/s multi‐chip optical communication |
| title_short | Electronic‐photonic board as an integration platform for Tb/s multi‐chip optical communication |
| title_sort | electronic photonic board as an integration platform for tb s multi chip optical communication |
| topic | electro‐optical devices elemental semiconductors flip‐chip devices integrated optics optical polymers optical switches |
| url | https://doi.org/10.1049/ote2.12017 |
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