Fabrication and Analysis Of 2D/3D Heterojunction Between Continuous Few-layer WS2 Film and Si (100)†

Transition metal dichalcogenide (TDMCs) placed on a 3D semiconductor substrate haveleads to significant advances in the electronic industry with new opportunities based on 2D/3D heterojunction based diverse devices without any restrictions, such as lattice compatibility. In this study, magnetron spu...

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Bibliographic Details
Main Authors: Merve Acar, Emre Gür, Mehmet Ertuğrul, Soheil Mobtakeri
Format: Article
Language:English
Published: Hitit University 2021-03-01
Series:Hittite Journal of Science and Engineering
Subjects:
Online Access:https://dergipark.org.tr/tr/download/article-file/1676223