Local electrochemical deposition of copper from sulfate solution
Local electrochemical deposition is a type of electroplating used to plate metal locally or form metal objects using electrochemical principles at a short distance from the working electrode. In this work, deposition of the copper spot was modelled using COMSOL software and experimentally tested in...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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International Association of Physical Chemists (IAPC)
2022-06-01
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| Series: | Journal of Electrochemical Science and Engineering |
| Subjects: | |
| Online Access: | https://pub.iapchem.org/ojs/index.php/JESE/article/view/1352 |
| _version_ | 1811240353907343360 |
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| author | Georgii Vasyliev Viktoria Vorobyova Dmytro Uschapovskiy Olga Linyucheva |
| author_facet | Georgii Vasyliev Viktoria Vorobyova Dmytro Uschapovskiy Olga Linyucheva |
| author_sort | Georgii Vasyliev |
| collection | DOAJ |
| description |
Local electrochemical deposition is a type of electroplating used to plate metal locally or form metal objects using electrochemical principles at a short distance from the working electrode. In this work, deposition of the copper spot was modelled using COMSOL software and experimentally tested in copper sulfate electrolyte using soluble copper anode. The working capillary diameter was 4 mm and the interelectrode distance was 5 mm. The deposited copper of 100 µm height was investigated using the 3D-profilometry technique. The geometry of deposited metal was found to be in good accordance with the COMSOL model. The inclusions of anodic sludge were responsible for the surface inhomogeneity of the deposited copper.
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| first_indexed | 2024-04-12T13:18:46Z |
| format | Article |
| id | doaj.art-850b212520b1407c8da88a470d41b917 |
| institution | Directory Open Access Journal |
| issn | 1847-9286 |
| language | English |
| last_indexed | 2024-04-12T13:18:46Z |
| publishDate | 2022-06-01 |
| publisher | International Association of Physical Chemists (IAPC) |
| record_format | Article |
| series | Journal of Electrochemical Science and Engineering |
| spelling | doaj.art-850b212520b1407c8da88a470d41b9172022-12-22T03:31:35ZengInternational Association of Physical Chemists (IAPC)Journal of Electrochemical Science and Engineering1847-92862022-06-0110.5599/jese.1352Local electrochemical deposition of copper from sulfate solutionGeorgii Vasyliev0Viktoria Vorobyova1Dmytro Uschapovskiy2Olga Linyucheva3National Technical University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute”, 37, Prospect Peremohy, Kyiv-56, 03056, UkraineNational Technical University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute”, 37, Prospect Peremohy, Kyiv-56, 03056, UkraineNational Technical University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute”, 37, Prospect Peremohy, Kyiv-56, 03056, UkraineNational Technical University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute”, 37, Prospect Peremohy, Kyiv-56, 03056, Ukraine Local electrochemical deposition is a type of electroplating used to plate metal locally or form metal objects using electrochemical principles at a short distance from the working electrode. In this work, deposition of the copper spot was modelled using COMSOL software and experimentally tested in copper sulfate electrolyte using soluble copper anode. The working capillary diameter was 4 mm and the interelectrode distance was 5 mm. The deposited copper of 100 µm height was investigated using the 3D-profilometry technique. The geometry of deposited metal was found to be in good accordance with the COMSOL model. The inclusions of anodic sludge were responsible for the surface inhomogeneity of the deposited copper. https://pub.iapchem.org/ojs/index.php/JESE/article/view/1352LECDadditive manufacturingCOMSOLcopper platingthrowing poweranodic sludge |
| spellingShingle | Georgii Vasyliev Viktoria Vorobyova Dmytro Uschapovskiy Olga Linyucheva Local electrochemical deposition of copper from sulfate solution Journal of Electrochemical Science and Engineering LECD additive manufacturing COMSOL copper plating throwing power anodic sludge |
| title | Local electrochemical deposition of copper from sulfate solution |
| title_full | Local electrochemical deposition of copper from sulfate solution |
| title_fullStr | Local electrochemical deposition of copper from sulfate solution |
| title_full_unstemmed | Local electrochemical deposition of copper from sulfate solution |
| title_short | Local electrochemical deposition of copper from sulfate solution |
| title_sort | local electrochemical deposition of copper from sulfate solution |
| topic | LECD additive manufacturing COMSOL copper plating throwing power anodic sludge |
| url | https://pub.iapchem.org/ojs/index.php/JESE/article/view/1352 |
| work_keys_str_mv | AT georgiivasyliev localelectrochemicaldepositionofcopperfromsulfatesolution AT viktoriavorobyova localelectrochemicaldepositionofcopperfromsulfatesolution AT dmytrouschapovskiy localelectrochemicaldepositionofcopperfromsulfatesolution AT olgalinyucheva localelectrochemicaldepositionofcopperfromsulfatesolution |