Slicing Ceramics on Material Removed by a Single Abrasive Particle

Slicing Ceramics on Material Removed by a Single Abrasive Particle

Multi-wire saw machining (MWSM) used for slicing hard-brittle materials in the semiconductor and photovoltaic industries is an important and efficient material removal process that uses free abrasives. The cutting model of single-wire saw machining (SWSM) is the basis of MWSM. The material removal m...

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Bibliographic Details
Main Authors: Yao-Yang Tsai, Ming-Chang Wu, Yunn-Shiuan Liao, Chung-Chen Tsao, Chun-Yao Hsu
Format: Article
Language:English
Published: MDPI AG 2020-09-01
Series:Materials
Subjects:
wire-saw machining
material removal processing
brittle fracture
plastic deformation
Online Access:https://www.mdpi.com/1996-1944/13/19/4324

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