Energy performance analysis of a cascade heat pump system for heating in a semiconductor fabrication plant

To reduce carbon emissions, active research is being conducted on replacing the heating equipment using fossil fuels with heat pumps. While heat pumps still utilize electricity and have associated carbon emissions, they possess the potential to consistently decrease carbon emissions owing to the gro...

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Main Authors: Taek-Don Kwon, Woo-Hyun Jung, Jae-Weon Jeong
Format: Article
Language:English
Published: Elsevier 2023-12-01
Series:Case Studies in Thermal Engineering
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2214157X23010511
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author Taek-Don Kwon
Woo-Hyun Jung
Jae-Weon Jeong
author_facet Taek-Don Kwon
Woo-Hyun Jung
Jae-Weon Jeong
author_sort Taek-Don Kwon
collection DOAJ
description To reduce carbon emissions, active research is being conducted on replacing the heating equipment using fossil fuels with heat pumps. While heat pumps still utilize electricity and have associated carbon emissions, they possess the potential to consistently decrease carbon emissions owing to the growing availability of renewable energy sources.In this study, the applicability of a heat pump system capable of supplying 86 °C hot water for heating a semiconductor fabrication plant was verified. In addition, there are a few results considering the energy saving effect that can be obtained from the heat source. Therefore, reflecting the characteristics of a semiconductor fabrication plant, which requires a huge cooling load to remove heat from equipment even in winters, a cascade heat pump system using a chiller as a low-cycle heat pump was proposed. Compared to a boiler, the heat pump system has the advantage of reducing the load on the typical chiller system as it can supply cold and hot water.On comparison, the cascade heat pump system, which incorporates the energy-saving effect derived from the heat source, demonstrated 66 % of primary energy and 56 % carbon emissions than the boiler. Consequently, the cascade heat pump outperformed the boiler system.
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spelling doaj.art-8581913338f041b7a517e401e7ad14902023-12-03T05:41:31ZengElsevierCase Studies in Thermal Engineering2214-157X2023-12-0152103745Energy performance analysis of a cascade heat pump system for heating in a semiconductor fabrication plantTaek-Don Kwon0Woo-Hyun Jung1Jae-Weon Jeong2Division of Global Fabrication & Infra Technology, Samsung Electronics, Hwaseong-si, Gyeonggi-do, 18448, Republic of Korea; Department of Architectural Engineering, College of Engineering, Hanyang University, Seoul, 04763, Republic of KoreaDivision of Global Fabrication & Infra Technology, Samsung Electronics, Hwaseong-si, Gyeonggi-do, 18448, Republic of KoreaDepartment of Architectural Engineering, College of Engineering, Hanyang University, Seoul, 04763, Republic of Korea; Corresponding author.To reduce carbon emissions, active research is being conducted on replacing the heating equipment using fossil fuels with heat pumps. While heat pumps still utilize electricity and have associated carbon emissions, they possess the potential to consistently decrease carbon emissions owing to the growing availability of renewable energy sources.In this study, the applicability of a heat pump system capable of supplying 86 °C hot water for heating a semiconductor fabrication plant was verified. In addition, there are a few results considering the energy saving effect that can be obtained from the heat source. Therefore, reflecting the characteristics of a semiconductor fabrication plant, which requires a huge cooling load to remove heat from equipment even in winters, a cascade heat pump system using a chiller as a low-cycle heat pump was proposed. Compared to a boiler, the heat pump system has the advantage of reducing the load on the typical chiller system as it can supply cold and hot water.On comparison, the cascade heat pump system, which incorporates the energy-saving effect derived from the heat source, demonstrated 66 % of primary energy and 56 % carbon emissions than the boiler. Consequently, the cascade heat pump outperformed the boiler system.http://www.sciencedirect.com/science/article/pii/S2214157X23010511Semiconductor fabrication plantCascade cycleCentrifugal heat pumpOutdoor air-conditionerHeating equipment
spellingShingle Taek-Don Kwon
Woo-Hyun Jung
Jae-Weon Jeong
Energy performance analysis of a cascade heat pump system for heating in a semiconductor fabrication plant
Case Studies in Thermal Engineering
Semiconductor fabrication plant
Cascade cycle
Centrifugal heat pump
Outdoor air-conditioner
Heating equipment
title Energy performance analysis of a cascade heat pump system for heating in a semiconductor fabrication plant
title_full Energy performance analysis of a cascade heat pump system for heating in a semiconductor fabrication plant
title_fullStr Energy performance analysis of a cascade heat pump system for heating in a semiconductor fabrication plant
title_full_unstemmed Energy performance analysis of a cascade heat pump system for heating in a semiconductor fabrication plant
title_short Energy performance analysis of a cascade heat pump system for heating in a semiconductor fabrication plant
title_sort energy performance analysis of a cascade heat pump system for heating in a semiconductor fabrication plant
topic Semiconductor fabrication plant
Cascade cycle
Centrifugal heat pump
Outdoor air-conditioner
Heating equipment
url http://www.sciencedirect.com/science/article/pii/S2214157X23010511
work_keys_str_mv AT taekdonkwon energyperformanceanalysisofacascadeheatpumpsystemforheatinginasemiconductorfabricationplant
AT woohyunjung energyperformanceanalysisofacascadeheatpumpsystemforheatinginasemiconductorfabricationplant
AT jaeweonjeong energyperformanceanalysisofacascadeheatpumpsystemforheatinginasemiconductorfabricationplant