Effect of Ag addition on the microstructure and corrosion properties of Sn–9Zn lead-free solder
The effects of Ag addition on the microstructure of Sn–9Zn alloy and its corrosion behaviour in neutral and static 3.5 wt% NaCl solutions were investigated using surface characterization techniques and electrochemical techniques. The results show that in Sn–9Zn-xAg alloys, Ag reacts with Zn to form...
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| Language: | English |
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Elsevier
2023-11-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423028971 |
| _version_ | 1797301466764935168 |
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| author | Cunji Pu Caiju Li Tinghao Dong Yingde Miao Peng Gao Xin Zhang Jubo Peng Jianhong Yi |
| author_facet | Cunji Pu Caiju Li Tinghao Dong Yingde Miao Peng Gao Xin Zhang Jubo Peng Jianhong Yi |
| author_sort | Cunji Pu |
| collection | DOAJ |
| description | The effects of Ag addition on the microstructure of Sn–9Zn alloy and its corrosion behaviour in neutral and static 3.5 wt% NaCl solutions were investigated using surface characterization techniques and electrochemical techniques. The results show that in Sn–9Zn-xAg alloys, Ag reacts with Zn to form AgZn3 intermetallic compounds (IMCs), which refined the microstructure of the alloys and changed the corrosion mode of the alloy surfaces from pitting corrosion to surface corrosion. The addition of Ag effectively improved the corrosion passivation film structure and electron transfer characteristics of the alloy, increased the self-corrosion potential (Ecorr) and reduced the self-corrosion current (Icorr), thus improving the corrosion resistance of the alloy. The study explained and verified the corrosion mechanism of the alloy from both experimental and theoretical perspectives. It is concluded that Sn–9Zn-0.4Ag alloy shows relatively the best corrosion resistance. |
| first_indexed | 2024-03-07T23:22:59Z |
| format | Article |
| id | doaj.art-87bb47a409974124bc5f26564220b9aa |
| institution | Directory Open Access Journal |
| issn | 2238-7854 |
| language | English |
| last_indexed | 2024-03-07T23:22:59Z |
| publishDate | 2023-11-01 |
| publisher | Elsevier |
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| series | Journal of Materials Research and Technology |
| spelling | doaj.art-87bb47a409974124bc5f26564220b9aa2024-02-21T05:28:02ZengElsevierJournal of Materials Research and Technology2238-78542023-11-012764006411Effect of Ag addition on the microstructure and corrosion properties of Sn–9Zn lead-free solderCunji Pu0Caiju Li1Tinghao Dong2Yingde Miao3Peng Gao4Xin Zhang5Jubo Peng6Jianhong Yi7Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming, 650093, China; Yunnan Engineering Research Center of Metallic Powder Materials, Kunming University of Science and Technology, Kunming, 650093, ChinaFaculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming, 650093, China; Yunnan Engineering Research Center of Metallic Powder Materials, Kunming University of Science and Technology, Kunming, 650093, China; Corresponding author. Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming, 650093, China.Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming, 650093, China; Yunnan Engineering Research Center of Metallic Powder Materials, Kunming University of Science and Technology, Kunming, 650093, ChinaFaculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming, 650093, China; Yunnan Engineering Research Center of Metallic Powder Materials, Kunming University of Science and Technology, Kunming, 650093, ChinaFaculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming, 650093, China; Yunnan Engineering Research Center of Metallic Powder Materials, Kunming University of Science and Technology, Kunming, 650093, ChinaYun Tin New Material Co. LTD of Yunnan Tin Group (Holding) Co. Ltd., Kunming, 650501, ChinaYunnan Tin Group (Holding) Co. Ltd., Kunming, 650501, ChinaFaculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming, 650093, China; Yunnan Engineering Research Center of Metallic Powder Materials, Kunming University of Science and Technology, Kunming, 650093, China; Corresponding author. Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming, 650093, China.The effects of Ag addition on the microstructure of Sn–9Zn alloy and its corrosion behaviour in neutral and static 3.5 wt% NaCl solutions were investigated using surface characterization techniques and electrochemical techniques. The results show that in Sn–9Zn-xAg alloys, Ag reacts with Zn to form AgZn3 intermetallic compounds (IMCs), which refined the microstructure of the alloys and changed the corrosion mode of the alloy surfaces from pitting corrosion to surface corrosion. The addition of Ag effectively improved the corrosion passivation film structure and electron transfer characteristics of the alloy, increased the self-corrosion potential (Ecorr) and reduced the self-corrosion current (Icorr), thus improving the corrosion resistance of the alloy. The study explained and verified the corrosion mechanism of the alloy from both experimental and theoretical perspectives. It is concluded that Sn–9Zn-0.4Ag alloy shows relatively the best corrosion resistance.http://www.sciencedirect.com/science/article/pii/S2238785423028971Sn–Zn–Ag alloyMicrostructureElectrochemical technologyCorrosion mechanismPassive films |
| spellingShingle | Cunji Pu Caiju Li Tinghao Dong Yingde Miao Peng Gao Xin Zhang Jubo Peng Jianhong Yi Effect of Ag addition on the microstructure and corrosion properties of Sn–9Zn lead-free solder Journal of Materials Research and Technology Sn–Zn–Ag alloy Microstructure Electrochemical technology Corrosion mechanism Passive films |
| title | Effect of Ag addition on the microstructure and corrosion properties of Sn–9Zn lead-free solder |
| title_full | Effect of Ag addition on the microstructure and corrosion properties of Sn–9Zn lead-free solder |
| title_fullStr | Effect of Ag addition on the microstructure and corrosion properties of Sn–9Zn lead-free solder |
| title_full_unstemmed | Effect of Ag addition on the microstructure and corrosion properties of Sn–9Zn lead-free solder |
| title_short | Effect of Ag addition on the microstructure and corrosion properties of Sn–9Zn lead-free solder |
| title_sort | effect of ag addition on the microstructure and corrosion properties of sn 9zn lead free solder |
| topic | Sn–Zn–Ag alloy Microstructure Electrochemical technology Corrosion mechanism Passive films |
| url | http://www.sciencedirect.com/science/article/pii/S2238785423028971 |
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