Alumina‐Epoxy‐Pore Composites Fabricated by Inkjet Printing for Wireless Communication Technology

Abstract Reducing transmission loss via composites with pores has emerged as a breakthrough method for information and communications technology applications. The super/extremely high‐frequency signals used in the technologies result in significant transmission loss. Demand for low‐loss materials wi...

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Main Authors: Seongguk Jeong, Kwangho Park, Myoung Pyo Chun, Jong Hee Kim, Dae Ho Yoon, Youngje Sung
Format: Article
Language:English
Published: Wiley-VCH 2024-03-01
Series:Advanced Materials Interfaces
Subjects:
Online Access:https://doi.org/10.1002/admi.202300890
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author Seongguk Jeong
Kwangho Park
Myoung Pyo Chun
Jong Hee Kim
Dae Ho Yoon
Youngje Sung
author_facet Seongguk Jeong
Kwangho Park
Myoung Pyo Chun
Jong Hee Kim
Dae Ho Yoon
Youngje Sung
author_sort Seongguk Jeong
collection DOAJ
description Abstract Reducing transmission loss via composites with pores has emerged as a breakthrough method for information and communications technology applications. The super/extremely high‐frequency signals used in the technologies result in significant transmission loss. Demand for low‐loss materials with low dielectric constant (Dk) and low dissipation factor (Df) has increased in recent years. Here, it is demonstrated that the pore in composites can be reduced Dk and Df of composites with pores (air). In fabrication of composites, a drop‐on‐demand (DOD) inkjet printing method to fabricate composites with pores (air) for use in wireless communications technologies. The DOD method is a simple but versatile manufacturing process at low cost. Its versatile process makes it possible to control the amount of resin and pore in fabrication of the composites and moreover to distribute all their components isotopically and homogeneously. It is possible to fabricate the composites with a lower Dk and Df value by increasing pore amount in the composites. This strategy enabled us to inexpensively manufacture dielectric substrates with low Dk and Df values, greatly contributing to the communications technology industry.
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spelling doaj.art-8889a83160644e4b9bbe91710e087a0d2024-03-14T09:17:45ZengWiley-VCHAdvanced Materials Interfaces2196-73502024-03-01118n/an/a10.1002/admi.202300890Alumina‐Epoxy‐Pore Composites Fabricated by Inkjet Printing for Wireless Communication TechnologySeongguk Jeong0Kwangho Park1Myoung Pyo Chun2Jong Hee Kim3Dae Ho Yoon4Youngje Sung5School of Advanced Materials Science & Engineering Sungkyunkwan University Suwon 16419 Republic of KoreaCorporate affiliated research institute CRHM Suwon 16336 Republic of KoreaCorporate affiliated research institute CRHM Suwon 16336 Republic of KoreaCorporate affiliated research institute CRHM Suwon 16336 Republic of KoreaSchool of Advanced Materials Science & Engineering Sungkyunkwan University Suwon 16419 Republic of KoreaCorporate affiliated research institute CRHM Suwon 16336 Republic of KoreaAbstract Reducing transmission loss via composites with pores has emerged as a breakthrough method for information and communications technology applications. The super/extremely high‐frequency signals used in the technologies result in significant transmission loss. Demand for low‐loss materials with low dielectric constant (Dk) and low dissipation factor (Df) has increased in recent years. Here, it is demonstrated that the pore in composites can be reduced Dk and Df of composites with pores (air). In fabrication of composites, a drop‐on‐demand (DOD) inkjet printing method to fabricate composites with pores (air) for use in wireless communications technologies. The DOD method is a simple but versatile manufacturing process at low cost. Its versatile process makes it possible to control the amount of resin and pore in fabrication of the composites and moreover to distribute all their components isotopically and homogeneously. It is possible to fabricate the composites with a lower Dk and Df value by increasing pore amount in the composites. This strategy enabled us to inexpensively manufacture dielectric substrates with low Dk and Df values, greatly contributing to the communications technology industry.https://doi.org/10.1002/admi.202300890compositesdielectricshermeticityinkjet printing processpore
spellingShingle Seongguk Jeong
Kwangho Park
Myoung Pyo Chun
Jong Hee Kim
Dae Ho Yoon
Youngje Sung
Alumina‐Epoxy‐Pore Composites Fabricated by Inkjet Printing for Wireless Communication Technology
Advanced Materials Interfaces
composites
dielectrics
hermeticity
inkjet printing process
pore
title Alumina‐Epoxy‐Pore Composites Fabricated by Inkjet Printing for Wireless Communication Technology
title_full Alumina‐Epoxy‐Pore Composites Fabricated by Inkjet Printing for Wireless Communication Technology
title_fullStr Alumina‐Epoxy‐Pore Composites Fabricated by Inkjet Printing for Wireless Communication Technology
title_full_unstemmed Alumina‐Epoxy‐Pore Composites Fabricated by Inkjet Printing for Wireless Communication Technology
title_short Alumina‐Epoxy‐Pore Composites Fabricated by Inkjet Printing for Wireless Communication Technology
title_sort alumina epoxy pore composites fabricated by inkjet printing for wireless communication technology
topic composites
dielectrics
hermeticity
inkjet printing process
pore
url https://doi.org/10.1002/admi.202300890
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AT myoungpyochun aluminaepoxyporecompositesfabricatedbyinkjetprintingforwirelesscommunicationtechnology
AT jongheekim aluminaepoxyporecompositesfabricatedbyinkjetprintingforwirelesscommunicationtechnology
AT daehoyoon aluminaepoxyporecompositesfabricatedbyinkjetprintingforwirelesscommunicationtechnology
AT youngjesung aluminaepoxyporecompositesfabricatedbyinkjetprintingforwirelesscommunicationtechnology