Physics of Failure (PoF) Based Lifetime Prediction of Power Electronics at the Printed Circuit Board Level
This paper presents the use of physics of failure (PoF) methodology to infer fast and accurate lifetime predictions for power electronics at the printed circuit board (PCB) level in early design stages. It is shown that the ability to accurately model silicon–metal layers, semiconductor packaging, p...
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-03-01
|
| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/11/6/2679 |
| _version_ | 1797541056828407808 |
|---|---|
| author | Andrew Wileman Suresh Perinpanayagam Sohaib Aslam |
| author_facet | Andrew Wileman Suresh Perinpanayagam Sohaib Aslam |
| author_sort | Andrew Wileman |
| collection | DOAJ |
| description | This paper presents the use of physics of failure (PoF) methodology to infer fast and accurate lifetime predictions for power electronics at the printed circuit board (PCB) level in early design stages. It is shown that the ability to accurately model silicon–metal layers, semiconductor packaging, printed circuit boards (PCBs), and assemblies allows, for instance, the prediction of solder fatigue failure due to thermal, mechanical, and manufacturing conditions. The technique allows a life-cycle prognosis of the PCB, taking into account the environmental stresses it will encounter during the period of operation. Primarily, it involves converting an electronic computer aided design (eCAD) circuit layout into computational fluid dynamic (CFD) and finite element analysis (FEA) models with accurate geometries. From this, stressors, such as thermal cycling, mechanical shock, natural frequency, and harmonic and random vibrations, are applied to understand PCB degradation, and semiconductor and capacitor wear, and accordingly provide a method for high-fidelity power PCB modelling, which can be subsequently used to facilitate virtual testing and digital twinning for aircraft systems and sub-systems. |
| first_indexed | 2024-03-10T13:09:49Z |
| format | Article |
| id | doaj.art-889bba8a27384cada34c03ae2b118ebd |
| institution | Directory Open Access Journal |
| issn | 2076-3417 |
| language | English |
| last_indexed | 2024-03-10T13:09:49Z |
| publishDate | 2021-03-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Applied Sciences |
| spelling | doaj.art-889bba8a27384cada34c03ae2b118ebd2023-11-21T10:50:49ZengMDPI AGApplied Sciences2076-34172021-03-01116267910.3390/app11062679Physics of Failure (PoF) Based Lifetime Prediction of Power Electronics at the Printed Circuit Board LevelAndrew Wileman0Suresh Perinpanayagam1Sohaib Aslam2Integrated Vehicle Health Management (IVHM) Centre, Cranfield University, Bedfordshire MK43 0AL, UKIntegrated Vehicle Health Management (IVHM) Centre, Cranfield University, Bedfordshire MK43 0AL, UKIntegrated Vehicle Health Management (IVHM) Centre, Cranfield University, Bedfordshire MK43 0AL, UKThis paper presents the use of physics of failure (PoF) methodology to infer fast and accurate lifetime predictions for power electronics at the printed circuit board (PCB) level in early design stages. It is shown that the ability to accurately model silicon–metal layers, semiconductor packaging, printed circuit boards (PCBs), and assemblies allows, for instance, the prediction of solder fatigue failure due to thermal, mechanical, and manufacturing conditions. The technique allows a life-cycle prognosis of the PCB, taking into account the environmental stresses it will encounter during the period of operation. Primarily, it involves converting an electronic computer aided design (eCAD) circuit layout into computational fluid dynamic (CFD) and finite element analysis (FEA) models with accurate geometries. From this, stressors, such as thermal cycling, mechanical shock, natural frequency, and harmonic and random vibrations, are applied to understand PCB degradation, and semiconductor and capacitor wear, and accordingly provide a method for high-fidelity power PCB modelling, which can be subsequently used to facilitate virtual testing and digital twinning for aircraft systems and sub-systems.https://www.mdpi.com/2076-3417/11/6/2679power electronicsphysics of failure (PoF)printed circuit boardfinite element analysis (FEA) |
| spellingShingle | Andrew Wileman Suresh Perinpanayagam Sohaib Aslam Physics of Failure (PoF) Based Lifetime Prediction of Power Electronics at the Printed Circuit Board Level Applied Sciences power electronics physics of failure (PoF) printed circuit board finite element analysis (FEA) |
| title | Physics of Failure (PoF) Based Lifetime Prediction of Power Electronics at the Printed Circuit Board Level |
| title_full | Physics of Failure (PoF) Based Lifetime Prediction of Power Electronics at the Printed Circuit Board Level |
| title_fullStr | Physics of Failure (PoF) Based Lifetime Prediction of Power Electronics at the Printed Circuit Board Level |
| title_full_unstemmed | Physics of Failure (PoF) Based Lifetime Prediction of Power Electronics at the Printed Circuit Board Level |
| title_short | Physics of Failure (PoF) Based Lifetime Prediction of Power Electronics at the Printed Circuit Board Level |
| title_sort | physics of failure pof based lifetime prediction of power electronics at the printed circuit board level |
| topic | power electronics physics of failure (PoF) printed circuit board finite element analysis (FEA) |
| url | https://www.mdpi.com/2076-3417/11/6/2679 |
| work_keys_str_mv | AT andrewwileman physicsoffailurepofbasedlifetimepredictionofpowerelectronicsattheprintedcircuitboardlevel AT sureshperinpanayagam physicsoffailurepofbasedlifetimepredictionofpowerelectronicsattheprintedcircuitboardlevel AT sohaibaslam physicsoffailurepofbasedlifetimepredictionofpowerelectronicsattheprintedcircuitboardlevel |