Highly Reliable Electrochemical Metallization Threshold Switch Through Conductive Filament Engineering Using Two‐Dimensional PtSe2 Insertion Layer

Highly Reliable Electrochemical Metallization Threshold Switch Through Conductive Filament Engineering Using Two‐Dimensional PtSe2 Insertion Layer

Abstract Electrochemical metallization threshold switch (ECM TS) has received significant attention for various applications owing to its high ON/OFF ratio, fast switching characteristics, and simple active electrode/dielectric layer/inert electrode structures. However, the excess diffusion of activ...

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Bibliographic Details
Main Authors: Min‐Su Kim, Euyjin Park, Seung‐Geun Kim, Jae‐Hyeun Park, Seung‐Hwan Kim, Kyu‐Hyun Han, Hyun‐Yong Yu
Format: Article
Language:English
Published: Wiley-VCH 2023-03-01
Series:Advanced Materials Interfaces
Subjects:
conductive filament
electrochemical metallization threshold switch
insertion layer
platinum diselenide
two‐dimensional material
Online Access:https://doi.org/10.1002/admi.202202296

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