Modeling and Design of Dual-Purpose MIV in Monolithic 3D IC
Transistor-level monolithic three-dimensional integrated circuit (M3D-IC) technology potential is compromised with the silicon footprint overhead caused by metal inter-layer via (MIV). To address this issue, we present a dual-purpose MIV-device utilization where MIV serves two purposes: 1. interconn...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2024-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10424972/ |