Effect of Cu Content on TiN-Cu Nanocomposite Film Properties: Structural and Hardness Studies

Effect of Cu Content on TiN-Cu Nanocomposite Film Properties: Structural and Hardness Studies

Titanium nitride-Copper (TiN-Cu) nanocomposite films were deposited onto stainless steel substrate using hollow cathode discharge ion plating technique. The influence of Cu content in the range of 2-7 at.% on the microstructure, morphology and mechanical properties of deposited films were investigat...

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Bibliographic Details
Main Authors:	M. M. Larijani, P. Balashabadi, H. Seyedi, E. Jafari-.Khamse
Format:	Article
Language:	English
Published:	Nanoscience and Nanotechnology Research Center, University of Kashan 2013-06-01
Series:	Journal of Nanostructures
Subjects:	Nanocomposite Thin film Soft phase
Online Access:	http://jns.kashanu.ac.ir/article_5464_c6e12bd73614a005b5618f91fe0aef06.pdf

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