Enhanced Thermal Stability of Sputtered TiN Thin Films for Their Applications as Diffusion Barriers against Copper Interconnect

Enhanced Thermal Stability of Sputtered TiN Thin Films for Their Applications as Diffusion Barriers against Copper Interconnect

In this work, the deposition of titanium nitride (TiN) thin film using direct current (DC) sputtering technique and its application as diffusion barriers against copper interconnect was presented. The deposited film was analyzed by using X-ray diffraction (XRD), field-emission scanning electron micr...

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Bibliographic Details
Main Authors: Abdullah Aljaafari, Faheem Ahmed, Nagih M. Shaalan, Shalendra Kumar, Abdullah Alsulami
Format: Article
Language:English
Published: MDPI AG 2023-05-01
Series:Inorganics
Subjects:
thin films
diffusion barriers
TiN
Sputtering
XRD
Online Access:https://www.mdpi.com/2304-6740/11/5/204

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