Void Suppression in Glass Frit Bonding Via Three-Step Annealing Process
In this work, void formation was systematically observed for the glass frit bonding technique as a function of the annealing temperature, annealing time, and annealing ambient. High annealing temperature and long annealing time were adopted to reach the maximum heat flux to avoid voids/bubbles. As d...
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-11-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/13/12/2104 |
| _version_ | 1827637755891417088 |
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| author | Yifang Liu Junyu Chen Jiaxin Jiang Gaofeng Zheng |
| author_facet | Yifang Liu Junyu Chen Jiaxin Jiang Gaofeng Zheng |
| author_sort | Yifang Liu |
| collection | DOAJ |
| description | In this work, void formation was systematically observed for the glass frit bonding technique as a function of the annealing temperature, annealing time, and annealing ambient. High annealing temperature and long annealing time were adopted to reach the maximum heat flux to avoid voids/bubbles. As demonstrated in the experiments, the voids appearing during glass frit bonding are related to the quantity of byproducts from the combustion of organic matter. The experimental results indicate that solely in air, under vacuum, or annealed for short time, the combustion products cannot be fully degassed, and voids occur. It was shown that the alternating three-step conditioning process including glass liquid forming in air, bubble removal under vacuum, and void filling-up in air can lead to void-free and uniform wafer bonding. The glass frit bonding samples with lots of voids/bubbles were compared to the ones without any defects. |
| first_indexed | 2024-03-09T16:05:17Z |
| format | Article |
| id | doaj.art-8ac092ad70054dab997b08568d1d3a28 |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-09T16:05:17Z |
| publishDate | 2022-11-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-8ac092ad70054dab997b08568d1d3a282023-11-24T16:44:14ZengMDPI AGMicromachines2072-666X2022-11-011312210410.3390/mi13122104Void Suppression in Glass Frit Bonding Via Three-Step Annealing ProcessYifang Liu0Junyu Chen1Jiaxin Jiang2Gaofeng Zheng3Department of Instrumental and Electrical Engineering, Xiamen University, Xiamen 361102, ChinaDepartment of Instrumental and Electrical Engineering, Xiamen University, Xiamen 361102, ChinaSchool of Mechanical and Automotive Engineering, Xiamen University of Technology, Xiamen 361024, ChinaDepartment of Instrumental and Electrical Engineering, Xiamen University, Xiamen 361102, ChinaIn this work, void formation was systematically observed for the glass frit bonding technique as a function of the annealing temperature, annealing time, and annealing ambient. High annealing temperature and long annealing time were adopted to reach the maximum heat flux to avoid voids/bubbles. As demonstrated in the experiments, the voids appearing during glass frit bonding are related to the quantity of byproducts from the combustion of organic matter. The experimental results indicate that solely in air, under vacuum, or annealed for short time, the combustion products cannot be fully degassed, and voids occur. It was shown that the alternating three-step conditioning process including glass liquid forming in air, bubble removal under vacuum, and void filling-up in air can lead to void-free and uniform wafer bonding. The glass frit bonding samples with lots of voids/bubbles were compared to the ones without any defects.https://www.mdpi.com/2072-666X/13/12/2104glass fritvoid suppressionannealingparameter optimization |
| spellingShingle | Yifang Liu Junyu Chen Jiaxin Jiang Gaofeng Zheng Void Suppression in Glass Frit Bonding Via Three-Step Annealing Process Micromachines glass frit void suppression annealing parameter optimization |
| title | Void Suppression in Glass Frit Bonding Via Three-Step Annealing Process |
| title_full | Void Suppression in Glass Frit Bonding Via Three-Step Annealing Process |
| title_fullStr | Void Suppression in Glass Frit Bonding Via Three-Step Annealing Process |
| title_full_unstemmed | Void Suppression in Glass Frit Bonding Via Three-Step Annealing Process |
| title_short | Void Suppression in Glass Frit Bonding Via Three-Step Annealing Process |
| title_sort | void suppression in glass frit bonding via three step annealing process |
| topic | glass frit void suppression annealing parameter optimization |
| url | https://www.mdpi.com/2072-666X/13/12/2104 |
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