Void Suppression in Glass Frit Bonding Via Three-Step Annealing Process

Void Suppression in Glass Frit Bonding Via Three-Step Annealing Process

In this work, void formation was systematically observed for the glass frit bonding technique as a function of the annealing temperature, annealing time, and annealing ambient. High annealing temperature and long annealing time were adopted to reach the maximum heat flux to avoid voids/bubbles. As d...

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Bibliographic Details
Main Authors: Yifang Liu, Junyu Chen, Jiaxin Jiang, Gaofeng Zheng
Format: Article
Language:English
Published: MDPI AG 2022-11-01
Series:Micromachines
Subjects:
glass frit
void suppression
annealing
parameter optimization
Online Access:https://www.mdpi.com/2072-666X/13/12/2104

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