APA (7th ed.) Citation

Gong, Y., Park, J. M., & Lim, J. (2016). An Interference-Assisted Thermal Bonding Method for the Fabrication of Thermoplastic Microfluidic Devices. MDPI AG.

Chicago Style (17th ed.) Citation

Gong, Yao, Jang Min Park, and Jiseok Lim. An Interference-Assisted Thermal Bonding Method for the Fabrication of Thermoplastic Microfluidic Devices. MDPI AG, 2016.

MLA (9th ed.) Citation

Gong, Yao, et al. An Interference-Assisted Thermal Bonding Method for the Fabrication of Thermoplastic Microfluidic Devices. MDPI AG, 2016.