An Interference-Assisted Thermal Bonding Method for the Fabrication of Thermoplastic Microfluidic Devices
Solutions for the bonding and sealing of micro-channels in the manufacturing process of microfluidic devices are limited; therefore, further technical developments are required to determine these solutions. In this study, a new bonding method for thermoplastic microfluidic devices was developed by c...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2016-11-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | http://www.mdpi.com/2072-666X/7/11/211 |
| _version_ | 1811326212079878144 |
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| author | Yao Gong Jang Min Park Jiseok Lim |
| author_facet | Yao Gong Jang Min Park Jiseok Lim |
| author_sort | Yao Gong |
| collection | DOAJ |
| description | Solutions for the bonding and sealing of micro-channels in the manufacturing process of microfluidic devices are limited; therefore, further technical developments are required to determine these solutions. In this study, a new bonding method for thermoplastic microfluidic devices was developed by combining an interference fit with a thermal treatment at low pressure. This involved a process of first injection molding thermoplastic substrates with a microchannel structure, and then performing bonding experiments at different bonding conditions. The results indicated the successful bonding of microchannels over a wide range of bonding pressures with the help of the interference fit. The study also determined additional advantages of the proposed bonding method by comparing the method with the conventional thermal bonding method. |
| first_indexed | 2024-04-13T14:46:10Z |
| format | Article |
| id | doaj.art-8b55a4fb1efc47afb4bf8e97d9850d96 |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-04-13T14:46:10Z |
| publishDate | 2016-11-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-8b55a4fb1efc47afb4bf8e97d9850d962022-12-22T02:42:44ZengMDPI AGMicromachines2072-666X2016-11-0171121110.3390/mi7110211mi7110211An Interference-Assisted Thermal Bonding Method for the Fabrication of Thermoplastic Microfluidic DevicesYao Gong0Jang Min Park1Jiseok Lim2School of Mechanical Engineering, Yeungnam University, Daehakro 280, Gyeongsan, 38541 Gyeongbuk, KoreaSchool of Mechanical Engineering, Yeungnam University, Daehakro 280, Gyeongsan, 38541 Gyeongbuk, KoreaSchool of Mechanical Engineering, Yeungnam University, Daehakro 280, Gyeongsan, 38541 Gyeongbuk, KoreaSolutions for the bonding and sealing of micro-channels in the manufacturing process of microfluidic devices are limited; therefore, further technical developments are required to determine these solutions. In this study, a new bonding method for thermoplastic microfluidic devices was developed by combining an interference fit with a thermal treatment at low pressure. This involved a process of first injection molding thermoplastic substrates with a microchannel structure, and then performing bonding experiments at different bonding conditions. The results indicated the successful bonding of microchannels over a wide range of bonding pressures with the help of the interference fit. The study also determined additional advantages of the proposed bonding method by comparing the method with the conventional thermal bonding method.http://www.mdpi.com/2072-666X/7/11/211lab-on-a-chipthermal bondinginterference fitinjection molding |
| spellingShingle | Yao Gong Jang Min Park Jiseok Lim An Interference-Assisted Thermal Bonding Method for the Fabrication of Thermoplastic Microfluidic Devices Micromachines lab-on-a-chip thermal bonding interference fit injection molding |
| title | An Interference-Assisted Thermal Bonding Method for the Fabrication of Thermoplastic Microfluidic Devices |
| title_full | An Interference-Assisted Thermal Bonding Method for the Fabrication of Thermoplastic Microfluidic Devices |
| title_fullStr | An Interference-Assisted Thermal Bonding Method for the Fabrication of Thermoplastic Microfluidic Devices |
| title_full_unstemmed | An Interference-Assisted Thermal Bonding Method for the Fabrication of Thermoplastic Microfluidic Devices |
| title_short | An Interference-Assisted Thermal Bonding Method for the Fabrication of Thermoplastic Microfluidic Devices |
| title_sort | interference assisted thermal bonding method for the fabrication of thermoplastic microfluidic devices |
| topic | lab-on-a-chip thermal bonding interference fit injection molding |
| url | http://www.mdpi.com/2072-666X/7/11/211 |
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