Low-temperature interconnection and strengthening mechanism of Cu/Cu joint with SAC particles solders
Composite solders of 1μmZn particles and Sn-0.3Ag-0.7Cu (SAC0307) with a particle size of 25∼38μmwas used to achieve micro-joining of Cu/Cu under ultrasonic-assisted at 180 °C, and aging at 125 °C was used to strengthen Cu/Cu joints. The results showed that interface intermetallic compounds (IMCs) b...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
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Elsevier
2023-07-01
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| Series: | Memories - Materials, Devices, Circuits and Systems |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2773064623000038 |
| _version_ | 1827917343099977728 |
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| author | Gui-sheng Gan Tian Huang Shi-qi Chen Liu-jie Jiang Da-yong Cheng Shu-ye Zhang |
| author_facet | Gui-sheng Gan Tian Huang Shi-qi Chen Liu-jie Jiang Da-yong Cheng Shu-ye Zhang |
| author_sort | Gui-sheng Gan |
| collection | DOAJ |
| description | Composite solders of 1μmZn particles and Sn-0.3Ag-0.7Cu (SAC0307) with a particle size of 25∼38μmwas used to achieve micro-joining of Cu/Cu under ultrasonic-assisted at 180 °C, and aging at 125 °C was used to strengthen Cu/Cu joints. The results showed that interface intermetallic compounds (IMCs) between Cu substrates and solder were mainly smooth Cu5Zn8, and the Zn–Sn–Cu phase was formed to complete interconnection between SAC0307 particles at 180 °C. With the increase of aging time, the shear strength of joints first increased and reached a peak value of 36.26MPa at 2h which was 21.8% higher than that of the as-received joints, then the shear strength decreased and tended to be stable at 24h which was increased by 10.0% compared with that of the as-received joints. |
| first_indexed | 2024-03-13T03:27:29Z |
| format | Article |
| id | doaj.art-8b9508e6c03247718b24c06ad9b54373 |
| institution | Directory Open Access Journal |
| issn | 2773-0646 |
| language | English |
| last_indexed | 2024-03-13T03:27:29Z |
| publishDate | 2023-07-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Memories - Materials, Devices, Circuits and Systems |
| spelling | doaj.art-8b9508e6c03247718b24c06ad9b543732023-06-25T04:45:07ZengElsevierMemories - Materials, Devices, Circuits and Systems2773-06462023-07-014100026Low-temperature interconnection and strengthening mechanism of Cu/Cu joint with SAC particles soldersGui-sheng Gan0Tian Huang1Shi-qi Chen2Liu-jie Jiang3Da-yong Cheng4Shu-ye Zhang5Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology, Chongqing University of Technology, Chongqing 400054, China; Golden Dragon Precise Copper Tube Group Inc, Chongqing 404000, China; Jiangsu Jiuxiang Automotive Electrical Group Co., Ltd, Xuzhou 221200, China; Corresponding author at: Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology, Chongqing University of Technology, Chongqing 400054, China.Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology, Chongqing University of Technology, Chongqing 400054, ChinaChongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology, Chongqing University of Technology, Chongqing 400054, ChinaChongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology, Chongqing University of Technology, Chongqing 400054, ChinaGolden Dragon Precise Copper Tube Group Inc, Chongqing 404000, ChinaState Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China; Corresponding author.Composite solders of 1μmZn particles and Sn-0.3Ag-0.7Cu (SAC0307) with a particle size of 25∼38μmwas used to achieve micro-joining of Cu/Cu under ultrasonic-assisted at 180 °C, and aging at 125 °C was used to strengthen Cu/Cu joints. The results showed that interface intermetallic compounds (IMCs) between Cu substrates and solder were mainly smooth Cu5Zn8, and the Zn–Sn–Cu phase was formed to complete interconnection between SAC0307 particles at 180 °C. With the increase of aging time, the shear strength of joints first increased and reached a peak value of 36.26MPa at 2h which was 21.8% higher than that of the as-received joints, then the shear strength decreased and tended to be stable at 24h which was increased by 10.0% compared with that of the as-received joints.http://www.sciencedirect.com/science/article/pii/S2773064623000038Sn-0.3Ag-0.7CuAging timeShear strengthUltrasonic-assistedIMCs |
| spellingShingle | Gui-sheng Gan Tian Huang Shi-qi Chen Liu-jie Jiang Da-yong Cheng Shu-ye Zhang Low-temperature interconnection and strengthening mechanism of Cu/Cu joint with SAC particles solders Memories - Materials, Devices, Circuits and Systems Sn-0.3Ag-0.7Cu Aging time Shear strength Ultrasonic-assisted IMCs |
| title | Low-temperature interconnection and strengthening mechanism of Cu/Cu joint with SAC particles solders |
| title_full | Low-temperature interconnection and strengthening mechanism of Cu/Cu joint with SAC particles solders |
| title_fullStr | Low-temperature interconnection and strengthening mechanism of Cu/Cu joint with SAC particles solders |
| title_full_unstemmed | Low-temperature interconnection and strengthening mechanism of Cu/Cu joint with SAC particles solders |
| title_short | Low-temperature interconnection and strengthening mechanism of Cu/Cu joint with SAC particles solders |
| title_sort | low temperature interconnection and strengthening mechanism of cu cu joint with sac particles solders |
| topic | Sn-0.3Ag-0.7Cu Aging time Shear strength Ultrasonic-assisted IMCs |
| url | http://www.sciencedirect.com/science/article/pii/S2773064623000038 |
| work_keys_str_mv | AT guishenggan lowtemperatureinterconnectionandstrengtheningmechanismofcucujointwithsacparticlessolders AT tianhuang lowtemperatureinterconnectionandstrengtheningmechanismofcucujointwithsacparticlessolders AT shiqichen lowtemperatureinterconnectionandstrengtheningmechanismofcucujointwithsacparticlessolders AT liujiejiang lowtemperatureinterconnectionandstrengtheningmechanismofcucujointwithsacparticlessolders AT dayongcheng lowtemperatureinterconnectionandstrengtheningmechanismofcucujointwithsacparticlessolders AT shuyezhang lowtemperatureinterconnectionandstrengtheningmechanismofcucujointwithsacparticlessolders |