Low-temperature interconnection and strengthening mechanism of Cu/Cu joint with SAC particles solders
Composite solders of 1μmZn particles and Sn-0.3Ag-0.7Cu (SAC0307) with a particle size of 25∼38μmwas used to achieve micro-joining of Cu/Cu under ultrasonic-assisted at 180 °C, and aging at 125 °C was used to strengthen Cu/Cu joints. The results showed that interface intermetallic compounds (IMCs) b...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-07-01
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| Series: | Memories - Materials, Devices, Circuits and Systems |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2773064623000038 |