Design, Processing, and Challenges of Multicomponent Polymer Composites for Improved Electromagnetic Interference Shielding Properties: A Review
Abstract The colossal development of modern electronic devices has inevitably led to an increase in electromagnetic interference (EMI), which has gradually become the fourth most prevalent type of pollution in the world. It is therefore necessary to seek more effective EMI‐shielding materials to ove...
| Main Authors: | , , , , , , , , , , , |
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| Format: | Article |
| Language: | English |
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Wiley-VCH
2024-04-01
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| Series: | Macromolecular Materials and Engineering |
| Subjects: | |
| Online Access: | https://doi.org/10.1002/mame.202300344 |
| _version_ | 1797207557793644544 |
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| author | Jixiang Li Emna Masghouni Mathis Granger Guillaume Sudre Pierre Alcouffe Didier Muller Van Son Nguyen Bernard Bayard Anatoli Serghei Bruno Sauviac Abderrahim Maazouz Khalid Lamnawar |
| author_facet | Jixiang Li Emna Masghouni Mathis Granger Guillaume Sudre Pierre Alcouffe Didier Muller Van Son Nguyen Bernard Bayard Anatoli Serghei Bruno Sauviac Abderrahim Maazouz Khalid Lamnawar |
| author_sort | Jixiang Li |
| collection | DOAJ |
| description | Abstract The colossal development of modern electronic devices has inevitably led to an increase in electromagnetic interference (EMI), which has gradually become the fourth most prevalent type of pollution in the world. It is therefore necessary to seek more effective EMI‐shielding materials to overcome the shortcomings of conventional metal‐based materials, which include high density, a lack of mechanical flexibility, low corrosion resistance and costly processing. Conductive polymer composites (CPCs) have attracted more and more attention due to their superiority in many aspects. However, their performances should be further enhanced for future applications. One polymer with only one type of filler often cannot meet this kind of requirement. In this paper, filled polymer materials for EMI shielding are reviewed in terms of their processing, rheological properties, conductivity, and shielding effectiveness. Moreover, the combination of different ingredients and fillers when fabricating multicomponent composites for EMI shielding is also highlighted. The coordination of various components in composites with different structures, including solid, segregated, layered/sandwiched, and foamed/porous structures, is then discussed. |
| first_indexed | 2024-04-24T09:24:49Z |
| format | Article |
| id | doaj.art-8b9ef4fd39314b5c9829cac583dc8b69 |
| institution | Directory Open Access Journal |
| issn | 1438-7492 1439-2054 |
| language | English |
| last_indexed | 2024-04-24T09:24:49Z |
| publishDate | 2024-04-01 |
| publisher | Wiley-VCH |
| record_format | Article |
| series | Macromolecular Materials and Engineering |
| spelling | doaj.art-8b9ef4fd39314b5c9829cac583dc8b692024-04-15T15:13:54ZengWiley-VCHMacromolecular Materials and Engineering1438-74921439-20542024-04-013094n/an/a10.1002/mame.202300344Design, Processing, and Challenges of Multicomponent Polymer Composites for Improved Electromagnetic Interference Shielding Properties: A ReviewJixiang Li0Emna Masghouni1Mathis Granger2Guillaume Sudre3Pierre Alcouffe4Didier Muller5Van Son Nguyen6Bernard Bayard7Anatoli Serghei8Bruno Sauviac9Abderrahim Maazouz10Khalid Lamnawar11Université de Lyon CNRS, UMR 5223 Ingénierie des Matériaux Polymères INSA Lyon Villeurbanne F‐69621 FranceUniversité de Lyon CNRS, UMR 5223 Ingénierie des Matériaux Polymères INSA Lyon Villeurbanne F‐69621 FranceUniversité Jean Monnet Saint‐Etienne CNRS Institut d'Optique Graduate School Laboratoire Hubert Curien UMR 5516 Saint‐Etienne F‐42023 FranceUniversité de Lyon CNRS, UMR 5223 Ingénierie des Matériaux Polymères UCBL Villeurbanne F‐69621 FranceUniversité de Lyon CNRS, UMR 5223 Ingénierie des Matériaux Polymères UCBL Villeurbanne F‐69621 FranceClayens NP Genas 69740 FranceClayens NP Genas 69740 FranceUniversité Jean Monnet Saint‐Etienne CNRS Institut d'Optique Graduate School Laboratoire Hubert Curien UMR 5516 Saint‐Etienne F‐42023 FranceUniversité de Lyon CNRS, UMR 5223 Ingénierie des Matériaux Polymères UCBL Villeurbanne F‐69621 FranceUniversité Jean Monnet Saint‐Etienne CNRS Institut d'Optique Graduate School Laboratoire Hubert Curien UMR 5516 Saint‐Etienne F‐42023 FranceUniversité de Lyon CNRS, UMR 5223 Ingénierie des Matériaux Polymères INSA Lyon Villeurbanne F‐69621 FranceUniversité de Lyon CNRS, UMR 5223 Ingénierie des Matériaux Polymères INSA Lyon Villeurbanne F‐69621 FranceAbstract The colossal development of modern electronic devices has inevitably led to an increase in electromagnetic interference (EMI), which has gradually become the fourth most prevalent type of pollution in the world. It is therefore necessary to seek more effective EMI‐shielding materials to overcome the shortcomings of conventional metal‐based materials, which include high density, a lack of mechanical flexibility, low corrosion resistance and costly processing. Conductive polymer composites (CPCs) have attracted more and more attention due to their superiority in many aspects. However, their performances should be further enhanced for future applications. One polymer with only one type of filler often cannot meet this kind of requirement. In this paper, filled polymer materials for EMI shielding are reviewed in terms of their processing, rheological properties, conductivity, and shielding effectiveness. Moreover, the combination of different ingredients and fillers when fabricating multicomponent composites for EMI shielding is also highlighted. The coordination of various components in composites with different structures, including solid, segregated, layered/sandwiched, and foamed/porous structures, is then discussed.https://doi.org/10.1002/mame.202300344conductive polymer compositesEMI shieldingmulticomponent compositespercolationstructure |
| spellingShingle | Jixiang Li Emna Masghouni Mathis Granger Guillaume Sudre Pierre Alcouffe Didier Muller Van Son Nguyen Bernard Bayard Anatoli Serghei Bruno Sauviac Abderrahim Maazouz Khalid Lamnawar Design, Processing, and Challenges of Multicomponent Polymer Composites for Improved Electromagnetic Interference Shielding Properties: A Review Macromolecular Materials and Engineering conductive polymer composites EMI shielding multicomponent composites percolation structure |
| title | Design, Processing, and Challenges of Multicomponent Polymer Composites for Improved Electromagnetic Interference Shielding Properties: A Review |
| title_full | Design, Processing, and Challenges of Multicomponent Polymer Composites for Improved Electromagnetic Interference Shielding Properties: A Review |
| title_fullStr | Design, Processing, and Challenges of Multicomponent Polymer Composites for Improved Electromagnetic Interference Shielding Properties: A Review |
| title_full_unstemmed | Design, Processing, and Challenges of Multicomponent Polymer Composites for Improved Electromagnetic Interference Shielding Properties: A Review |
| title_short | Design, Processing, and Challenges of Multicomponent Polymer Composites for Improved Electromagnetic Interference Shielding Properties: A Review |
| title_sort | design processing and challenges of multicomponent polymer composites for improved electromagnetic interference shielding properties a review |
| topic | conductive polymer composites EMI shielding multicomponent composites percolation structure |
| url | https://doi.org/10.1002/mame.202300344 |
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