An Attention-Augmented Convolutional Neural Network With Focal Loss for Mixed-Type Wafer Defect Classification

Silicon wafer defect classification is crucial for improving fabrication and chip production. Although deep learning methods have been successful in single-defect wafer classification, the increasing complexity of the fabrication process has introduced the challenge of multiple defects on wafers, wh...

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Main Authors: Uzma Batool, Mohd Ibrahim Shapiai, Salama A. Mostafa, Mohd Zamri Ibrahim
Format: Article
Language:English
Published: IEEE 2023-01-01
Series:IEEE Access
Subjects:
Online Access:https://ieeexplore.ieee.org/document/10268403/
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author Uzma Batool
Mohd Ibrahim Shapiai
Salama A. Mostafa
Mohd Zamri Ibrahim
author_facet Uzma Batool
Mohd Ibrahim Shapiai
Salama A. Mostafa
Mohd Zamri Ibrahim
author_sort Uzma Batool
collection DOAJ
description Silicon wafer defect classification is crucial for improving fabrication and chip production. Although deep learning methods have been successful in single-defect wafer classification, the increasing complexity of the fabrication process has introduced the challenge of multiple defects on wafers, which requires more robust feature learning and classification techniques. Attention mechanisms have been used to enhance feature learning for multiple wafer defects. However, they have limited use in a few mixed-type defect categories, and their performance declines as the number of mixed patterns increases. This work proposes an attention-augmented convolutional neural networks (A2CNN) model for enhanced discriminative feature learning of complex defects. The A2CNN model emphasizes the features in the channel and spatial dimensions. Additionally, the model adopts the focal loss function to reduce misclassification and a global average pooling layer to enhance the network’s generalization by reducing overfitting. The A2CNN model is evaluated on the MixedWM38 wafer defect dataset using 10-fold cross-validation. It achieves impressive results, with accuracy, precision, recall, and F1-score reported as 98.66%, 99.0%, 98.55%, and 98.82% respectively. Compared to existing works, the A2CNN model performs better by effectively learning valuable information for complex mixed-type wafer defects.
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spelling doaj.art-8c02eab9b67e4750ac72370e435df47d2023-10-11T23:00:17ZengIEEEIEEE Access2169-35362023-01-011110889110890510.1109/ACCESS.2023.332102510268403An Attention-Augmented Convolutional Neural Network With Focal Loss for Mixed-Type Wafer Defect ClassificationUzma Batool0https://orcid.org/0000-0003-0589-5643Mohd Ibrahim Shapiai1https://orcid.org/0000-0003-0594-8231Salama A. Mostafa2https://orcid.org/0000-0001-5348-502XMohd Zamri Ibrahim3https://orcid.org/0000-0003-0795-4096Centre for Artificial Intelligence and Robotics iKohza, Malaysia–Japan International Institute of Technology, Universiti Teknologi Malaysia, Kuala Lumpur, MalaysiaCentre for Artificial Intelligence and Robotics iKohza, Malaysia–Japan International Institute of Technology, Universiti Teknologi Malaysia, Kuala Lumpur, MalaysiaFaculty of Computer Science and Information Technology, Universiti Tun Hussein Onn Malaysia, Parit Raja, Johor, MalaysiaFaculty of Electrical and Electronics Engineering Technology, Universiti Malaysia Pahang, Pekan, Pahang, MalaysiaSilicon wafer defect classification is crucial for improving fabrication and chip production. Although deep learning methods have been successful in single-defect wafer classification, the increasing complexity of the fabrication process has introduced the challenge of multiple defects on wafers, which requires more robust feature learning and classification techniques. Attention mechanisms have been used to enhance feature learning for multiple wafer defects. However, they have limited use in a few mixed-type defect categories, and their performance declines as the number of mixed patterns increases. This work proposes an attention-augmented convolutional neural networks (A2CNN) model for enhanced discriminative feature learning of complex defects. The A2CNN model emphasizes the features in the channel and spatial dimensions. Additionally, the model adopts the focal loss function to reduce misclassification and a global average pooling layer to enhance the network’s generalization by reducing overfitting. The A2CNN model is evaluated on the MixedWM38 wafer defect dataset using 10-fold cross-validation. It achieves impressive results, with accuracy, precision, recall, and F1-score reported as 98.66%, 99.0%, 98.55%, and 98.82% respectively. Compared to existing works, the A2CNN model performs better by effectively learning valuable information for complex mixed-type wafer defects.https://ieeexplore.ieee.org/document/10268403/Anomaly detectiondeep learningmixed-type defectsmulti-defect classificationpattern recognitionchannel attention
spellingShingle Uzma Batool
Mohd Ibrahim Shapiai
Salama A. Mostafa
Mohd Zamri Ibrahim
An Attention-Augmented Convolutional Neural Network With Focal Loss for Mixed-Type Wafer Defect Classification
IEEE Access
Anomaly detection
deep learning
mixed-type defects
multi-defect classification
pattern recognition
channel attention
title An Attention-Augmented Convolutional Neural Network With Focal Loss for Mixed-Type Wafer Defect Classification
title_full An Attention-Augmented Convolutional Neural Network With Focal Loss for Mixed-Type Wafer Defect Classification
title_fullStr An Attention-Augmented Convolutional Neural Network With Focal Loss for Mixed-Type Wafer Defect Classification
title_full_unstemmed An Attention-Augmented Convolutional Neural Network With Focal Loss for Mixed-Type Wafer Defect Classification
title_short An Attention-Augmented Convolutional Neural Network With Focal Loss for Mixed-Type Wafer Defect Classification
title_sort attention augmented convolutional neural network with focal loss for mixed type wafer defect classification
topic Anomaly detection
deep learning
mixed-type defects
multi-defect classification
pattern recognition
channel attention
url https://ieeexplore.ieee.org/document/10268403/
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