Boosting Thermoelectric Performance of Bi2Te3 Material by Microstructure Engineering

Abstract Due to the intrinsic contradiction of electrical conductivity and Seebeck coefficient in thermoelectric materials, the enhancement for the power factor (PF) is limited. Since the PF decides the output power, strategies to the enhancement of PF are of paramount importance. In this work, Bi2T...

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Main Authors: Guoxiang Wang, Fanzheng Meng, Yingqi Chen, Andriy Lotnyk, Xiang Shen
Format: Article
Language:English
Published: Wiley 2024-02-01
Series:Advanced Science
Subjects:
Online Access:https://doi.org/10.1002/advs.202308056
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author Guoxiang Wang
Fanzheng Meng
Yingqi Chen
Andriy Lotnyk
Xiang Shen
author_facet Guoxiang Wang
Fanzheng Meng
Yingqi Chen
Andriy Lotnyk
Xiang Shen
author_sort Guoxiang Wang
collection DOAJ
description Abstract Due to the intrinsic contradiction of electrical conductivity and Seebeck coefficient in thermoelectric materials, the enhancement for the power factor (PF) is limited. Since the PF decides the output power, strategies to the enhancement of PF are of paramount importance. In this work, Bi2Te3/Sb and Bi2Te3/W multilayer films are proposed to enhance the thermoelectric properties. Both systems possess extremely high conductivity of ≈5.6 × 105 S m−1. Moreover, the electrical conductivity and Seebeck coefficient simultaneously increase as temperature rising, showing the overcome of the intrinsic contradiction. This results in ultrahigh PFs of 1785 µWm−1 K−2 for Bi2Te3/W and of 1566 µWm−1 K−2 for Bi2Te3/Sb at 600 K. Thermal heating of the Bi2Te3/Sb multilayer system shows compositional changes with subsequent formation of Bi‐Te‐Sb phases, Sb‐rich Bi‐Te precipitates, and cavities. Contrary, the multilayer structure of the Bi2Te3/W films is maintained, while Bi2Te3 grains of high‐crystalline quality are confined between the W layers. In addition, bilayer defects in Bi2Te3 and smaller cavities at the interface to W layers are also observed. Thus, compositional and confinement effects as well as structural defects result in the ultrahigh PF. Overall, this work demonstrates the strategies on how to obtain ultrahigh PFs of commercial Bi2Te3 material by microstructure engineering using multilayer structures.
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spelling doaj.art-8c04409e12514742a81ed2370cacbe342024-02-09T08:26:35ZengWileyAdvanced Science2198-38442024-02-01116n/an/a10.1002/advs.202308056Boosting Thermoelectric Performance of Bi2Te3 Material by Microstructure EngineeringGuoxiang Wang0Fanzheng Meng1Yingqi Chen2Andriy Lotnyk3Xiang Shen4Laboratory of Infrared Materials and Devices The Research Institute of Advanced Technologies Ningbo University Ningbo Zhejiang 315211 ChinaLaboratory of Infrared Materials and Devices The Research Institute of Advanced Technologies Ningbo University Ningbo Zhejiang 315211 ChinaLaboratory of Infrared Materials and Devices The Research Institute of Advanced Technologies Ningbo University Ningbo Zhejiang 315211 ChinaLaboratory of Infrared Materials and Devices The Research Institute of Advanced Technologies Ningbo University Ningbo Zhejiang 315211 ChinaLaboratory of Infrared Materials and Devices The Research Institute of Advanced Technologies Ningbo University Ningbo Zhejiang 315211 ChinaAbstract Due to the intrinsic contradiction of electrical conductivity and Seebeck coefficient in thermoelectric materials, the enhancement for the power factor (PF) is limited. Since the PF decides the output power, strategies to the enhancement of PF are of paramount importance. In this work, Bi2Te3/Sb and Bi2Te3/W multilayer films are proposed to enhance the thermoelectric properties. Both systems possess extremely high conductivity of ≈5.6 × 105 S m−1. Moreover, the electrical conductivity and Seebeck coefficient simultaneously increase as temperature rising, showing the overcome of the intrinsic contradiction. This results in ultrahigh PFs of 1785 µWm−1 K−2 for Bi2Te3/W and of 1566 µWm−1 K−2 for Bi2Te3/Sb at 600 K. Thermal heating of the Bi2Te3/Sb multilayer system shows compositional changes with subsequent formation of Bi‐Te‐Sb phases, Sb‐rich Bi‐Te precipitates, and cavities. Contrary, the multilayer structure of the Bi2Te3/W films is maintained, while Bi2Te3 grains of high‐crystalline quality are confined between the W layers. In addition, bilayer defects in Bi2Te3 and smaller cavities at the interface to W layers are also observed. Thus, compositional and confinement effects as well as structural defects result in the ultrahigh PF. Overall, this work demonstrates the strategies on how to obtain ultrahigh PFs of commercial Bi2Te3 material by microstructure engineering using multilayer structures.https://doi.org/10.1002/advs.202308056microstructuremultilayerpower factorthermoelectric film
spellingShingle Guoxiang Wang
Fanzheng Meng
Yingqi Chen
Andriy Lotnyk
Xiang Shen
Boosting Thermoelectric Performance of Bi2Te3 Material by Microstructure Engineering
Advanced Science
microstructure
multilayer
power factor
thermoelectric film
title Boosting Thermoelectric Performance of Bi2Te3 Material by Microstructure Engineering
title_full Boosting Thermoelectric Performance of Bi2Te3 Material by Microstructure Engineering
title_fullStr Boosting Thermoelectric Performance of Bi2Te3 Material by Microstructure Engineering
title_full_unstemmed Boosting Thermoelectric Performance of Bi2Te3 Material by Microstructure Engineering
title_short Boosting Thermoelectric Performance of Bi2Te3 Material by Microstructure Engineering
title_sort boosting thermoelectric performance of bi2te3 material by microstructure engineering
topic microstructure
multilayer
power factor
thermoelectric film
url https://doi.org/10.1002/advs.202308056
work_keys_str_mv AT guoxiangwang boostingthermoelectricperformanceofbi2te3materialbymicrostructureengineering
AT fanzhengmeng boostingthermoelectricperformanceofbi2te3materialbymicrostructureengineering
AT yingqichen boostingthermoelectricperformanceofbi2te3materialbymicrostructureengineering
AT andriylotnyk boostingthermoelectricperformanceofbi2te3materialbymicrostructureengineering
AT xiangshen boostingthermoelectricperformanceofbi2te3materialbymicrostructureengineering