Investigation on the Novel High-performance Copper/Graphene Composite Conductor for High Power Density Motor

High-performance Cu/Graphene composite wire synergistically strengthened by nano Cr 3 C 2 phase was directly synthesized via hot press sintering followed by severe cold plastic deformation, using liquid paraffin and CuCr alloy powder as the raw materials. Since graphene is in situ formed under the c...

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Main Authors: Jiaxiao Wang, Tingting Zuo, Jiangli Xue, Yadong Ru, Yue Wu, Zhuang Xu, Yongsheng Liu, Zhaoshun Gao, Puqi Ning, Tao Fan, Xuhui Wen, Li Han, Liye Xiao
Format: Article
Language:English
Published: China Electrotechnical Society 2024-03-01
Series:CES Transactions on Electrical Machines and Systems
Subjects:
Online Access:https://ieeexplore.ieee.org/document/10471246
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author Jiaxiao Wang
Tingting Zuo
Jiangli Xue
Yadong Ru
Yue Wu
Zhuang Xu
Yongsheng Liu
Zhaoshun Gao
Puqi Ning
Tao Fan
Xuhui Wen
Li Han
Liye Xiao
author_facet Jiaxiao Wang
Tingting Zuo
Jiangli Xue
Yadong Ru
Yue Wu
Zhuang Xu
Yongsheng Liu
Zhaoshun Gao
Puqi Ning
Tao Fan
Xuhui Wen
Li Han
Liye Xiao
author_sort Jiaxiao Wang
collection DOAJ
description High-performance Cu/Graphene composite wire synergistically strengthened by nano Cr 3 C 2 phase was directly synthesized via hot press sintering followed by severe cold plastic deformation, using liquid paraffin and CuCr alloy powder as the raw materials. Since graphene is in situ formed under the catalysis of copper powder during the sintering process, the problem that graphene is easy to agglomerate and difficult to disperse uniformly in the copper matrix has been solved. The nano Cr 3 C 2 -particles nailed at the interface favor to improve the interface bonding. The Cu/Graphene composite possesses high electrical conductivity, hardness, and plasticity. The composite wire exhibits high electrical conductivity of 96.93% IACS, great tensile strength of 488 MPa, and excellent resistance to softening. Even after annealing at 400°C for 1 h, the tensile strength can still reach 268 MPa with a conductivity of about 99.14% IACS. The wire's temperature coefficient of resistance (TCR) is largely reduced to 0.0035/°C due to the complex structure, which leads the wire to present low resistivity at higher temperatures. Such Cu/Graphene composite wire with excellent comprehensive performance has a good application prospect in high-power density motors.
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spelling doaj.art-8c2b8a71d7c54d879f22fa86569f0f9f2024-04-07T08:54:52ZengChina Electrotechnical SocietyCES Transactions on Electrical Machines and Systems2096-35642837-03252024-03-0181808510.30941/CESTEMS.2024.00009Investigation on the Novel High-performance Copper/Graphene Composite Conductor for High Power Density MotorJiaxiao Wang0Tingting Zuo1https://orcid.org/0000-0002-7758-4353Jiangli Xue2Yadong Ru3Yue Wu4https://orcid.org/0000-0003-1479-8108Zhuang Xu5Yongsheng Liu6Zhaoshun Gao7Puqi Ning8https://orcid.org/0000-0002-8621-8435Tao Fan9https://orcid.org/0000-0001-9193-2855Xuhui Wen10Li Han11Liye Xiao12https://orcid.org/0009-0009-3261-3796Chinese Academy of SciencesChinese Academy of SciencesChinese Academy of SciencesChinese Academy of SciencesChinese Academy of SciencesChinese Academy of SciencesShanghai University of Electric PowerChinese Academy of SciencesUniversity of Chinese Academy of SciencesUniversity of Chinese Academy of SciencesChinese Academy of SciencesChinese Academy of SciencesChinese Academy of SciencesHigh-performance Cu/Graphene composite wire synergistically strengthened by nano Cr 3 C 2 phase was directly synthesized via hot press sintering followed by severe cold plastic deformation, using liquid paraffin and CuCr alloy powder as the raw materials. Since graphene is in situ formed under the catalysis of copper powder during the sintering process, the problem that graphene is easy to agglomerate and difficult to disperse uniformly in the copper matrix has been solved. The nano Cr 3 C 2 -particles nailed at the interface favor to improve the interface bonding. The Cu/Graphene composite possesses high electrical conductivity, hardness, and plasticity. The composite wire exhibits high electrical conductivity of 96.93% IACS, great tensile strength of 488 MPa, and excellent resistance to softening. Even after annealing at 400°C for 1 h, the tensile strength can still reach 268 MPa with a conductivity of about 99.14% IACS. The wire's temperature coefficient of resistance (TCR) is largely reduced to 0.0035/°C due to the complex structure, which leads the wire to present low resistivity at higher temperatures. Such Cu/Graphene composite wire with excellent comprehensive performance has a good application prospect in high-power density motors.https://ieeexplore.ieee.org/document/10471246cu/graphene compositemechanical propertieselectrical propertymicrostructuretemperature coefficient of resistance
spellingShingle Jiaxiao Wang
Tingting Zuo
Jiangli Xue
Yadong Ru
Yue Wu
Zhuang Xu
Yongsheng Liu
Zhaoshun Gao
Puqi Ning
Tao Fan
Xuhui Wen
Li Han
Liye Xiao
Investigation on the Novel High-performance Copper/Graphene Composite Conductor for High Power Density Motor
CES Transactions on Electrical Machines and Systems
cu/graphene composite
mechanical properties
electrical property
microstructure
temperature coefficient of resistance
title Investigation on the Novel High-performance Copper/Graphene Composite Conductor for High Power Density Motor
title_full Investigation on the Novel High-performance Copper/Graphene Composite Conductor for High Power Density Motor
title_fullStr Investigation on the Novel High-performance Copper/Graphene Composite Conductor for High Power Density Motor
title_full_unstemmed Investigation on the Novel High-performance Copper/Graphene Composite Conductor for High Power Density Motor
title_short Investigation on the Novel High-performance Copper/Graphene Composite Conductor for High Power Density Motor
title_sort investigation on the novel high performance copper graphene composite conductor for high power density motor
topic cu/graphene composite
mechanical properties
electrical property
microstructure
temperature coefficient of resistance
url https://ieeexplore.ieee.org/document/10471246
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