| Summary: | Achieving high processing speed in electronic components combined with large amount of generated heat, this heat removed by heat sink. For extreme heat generated, a mini-channel liquid cooled heat sink is used. The aims of the present study are to enhance the efficiency of the serpentine mini-channel heat sink and to uniformly temperature distribute. To achieve that, several variables were studied, namely the double outlet, the secondary flow channel with different backwards angles (45°, 53°, 61°) and finally the combination of secondary flow with pin fin at different pitch distances (5d, 6d, 7d). Ansys Fluent 2020 R2 software was utilized to extract the numerical results. The two models were fabricated and tested experimentally, namely the Basic model and the optimum model (model F), to validate the numerical results. The results of validation showed a good agreement. The results show that the use of a double outlet serpentine mini channel heat sink leads to an increase in overall performance to 1.47 and a lower maximum base temperature. With an 8.7% increase in overall performance and an even lower base temperature, the secondary flow backward angle of 53° (model C) outperforms the other two angles. However, combining the secondary flow with the pin fin enhances the heat sink both thermally and hydraulically. The model F displays the maximum performance with a 1.79 and a Nusselt number of 9.64% as compared to the Basic model.
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