Hybrid Soldering 2.3D Assembly With High Reliability and Low Cost
In this study, an advanced 2.3D solution was proposed to integrate RDL interposer and FR-4 substrate using the technique of hybrid soldering, which applies printing of epoxy solder paste to form the hybrid joint. The simulation was performed to evaluate warpage and von Mises stress of different join...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2022-01-01
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| Series: | IEEE Journal of the Electron Devices Society |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/9888764/ |